5.4.
RF Characteristics ................................................................................................................... 36
5.5.
ESD Characteristics ................................................................................................................ 38
6
Dimensions and Packaging .............................................................................................................. 40
6.1.
General Description ................................................................................................................. 40
6.2.
6.3.
6.4.
Packaging Specifications ......................................................................................................... 42
7
Appendix A References ..................................................................................................................... 43
EC200T_Mini_PCIe_Hardware_Design
LTE Standard Module Series
EC200T Mini PCIe Hardware Design
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