Specifications; Safety Check-Out; Unleaded Solder - Sony MHS-TS22 Service Manual

Camera
[Input and Output connectors]
HDMI jack: HDMI mini connector
[System]
Built-in USB arm: type A (built-in)
Image device: 4.5 mm (1/4 type) CMOS sensor
USB communication: Hi-Speed USB (USB 2.0
Total pixel number of camera:
compliant)
Approx. 5 110 000 pixels
Effective pixel number of camera:
[LCD screen]
Approx. 3 110 000 pixels (still image, 16:9),
LCD screen: 6.7 cm 2.7 type (16:9) TFT drive
Approx. 5 030 000 pixels (still image, 4:3),
Total number of dots: 230 400 (960 × 240) dots
Approx. 3 110 000 pixels ([1920×1080 30p]
movie)
[Power, general]
Lens: F2.8
Power:
f = 4.1 mm (3/16 inches)
Built-in rechargeable battery pack
When converted to a 35 mm still camera
USB charging
For movies: 47 mm (1 7/8 inches) (16:9)
Charging time: Approx. 210 mins. (full charge)
For still images: 41 mm (1 5/8 inches) (4:3)
(when charging from the USB connector of
Exposure control: Automatic exposure
the computer)
File format:
Power consumption (during shooting): 1.5 W
Still images: JPEG (DCF Ver. 2.0, Exif Ver.
(when the movie image size is [1280×720
2.3, MPF Baseline) compliant
30p])
Movies: MPEG-4 AVC/H.264 (MP4)
Operating temperature:
Audio: MPEG AAC
0°C to 40°C (32°F to 104°F)
Recording media: Internal Memory (Approx.
Storage temperature:
3.9 GB)
–20°C to +60°C (–4°F to +140°F)
• When measuring media capacity, 1 GB equals
Dimensions (Approx.):
1 billion bytes, a portion of which is used for
59.6 mm × 116.5 mm × 21.0 mm
system management and/or application files.
(2 3/8 inches × 4 5/8 inches × 27/32 inches)
Available user capacity is as below.
(W/H/D, excluding protrusions)
Approx. 3.7 GB
MHS-TS22

SPECIFICATIONS

Mass:
Approx. 148 g (5.2 oz)
Microphone: Monaural
Speaker: Monaural
Design and specifications are subject to change
without notice.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
2. Check the interboard wiring to ensure that no wires are "pinched"
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 350°C during
repairing.
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
– 2 –
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.

SAFETY CHECK-OUT

UNLEADED SOLDER

This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350°C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.