Recommended Flux: Specific Gravity
Type
RMA (lower residue, non-cleaning type)
Note: See
ABOUT LEAD FREE SOLDER (PbF: Pb free)
29.2. Procedure
1. Tack the flat pack IC to the PCB by temporarily soldering two
diagonally opposite pins in the correct positions on the PCB.
2. Apply flux to all of the pins on the IC.
3. Being careful to not unsolder the tack points, slide the soldering iron
along the tips of the pins while feeding enough solder to the tip so
that it flows under the pins as they are heated.
29.3. Modification Procedure of Bridge
Be certain each pin is located over the correct pad on the PCB.
0.82.
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