Renesas IE-703107-MC-EM1 User Manual
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Renesas IE-703107-MC-EM1 User Manual

Renesas IE-703107-MC-EM1 User Manual

In-circuit emulator option board
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On April 1
, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.
Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
Old Company Name in Catalogs and Other Documents
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April 1
, 2010
Renesas Electronics Corporation

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Summary of Contents for Renesas IE-703107-MC-EM1

  • Page 1 On April 1 , 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.
  • Page 2 Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific”...
  • Page 3 User’s Manual IE-703107-MC-EM1 In-Circuit Emulator Option Board Target Devices V850E/MA1 V850E/MA2 Document No. U14481EJ3V0UM00 (3rd edition) Date Published August 2004 NS CP(K) © Printed in Japan...
  • Page 4 [MEMO] User’s Manual U14481EJ3V0UM...
  • Page 5 Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and/or other countries. PC/AT is a trademark of International Business Machines Corporation. • The information in this document is current as of August, 2004. The information is subject to change without notice.
  • Page 6 Regional Information Some information contained in this document may vary from country to country. Before using any NEC Electronics product in your application, pIease contact the NEC Electronics office in your country to obtain a list of authorized representatives and distributors. They will verify: •...
  • Page 7 General Precautions on Handling This Product 1. Cases in which NEC Electronics warranty does not apply • When the product is disassembled, reconstructed, or modified by the user • When the product receives a heavy shock such as being dropped or falling down •...
  • Page 8 The IE-703107-MC-EM1 is used connected to the IE-V850E-MC-A in-circuit emulator. This manual explains the basic setup procedure and switch settings of the IE-703107-MC-EM1. For the names and functions, and the connection of parts, refer to the IE-V850E-MC, IE-V850E-MC-A User’s Manual (U14487E), which is a separate volume.
  • Page 9 However, preliminary versions are not marked as such. Documents related to development tools (user’s manuals) Product Name Document Number IE-V850E-MC, IE-V850E-MC-A (In-Circuit Emulator) U14487E IE-703107-MC-EM1 (In-Circuit Emulator Option Board) This manual V850E/MA1 Hardware U14359E V850E/MA2 Hardware U14980E V850 Series Development Tools (Supporting 32-Bit OS) Windows...

  • Page 10: Table Of Contents

    CONTENTS CHAPTER 1 OVERVIEW..........................10 Hardware Configuration ......................11 Hardware Specifications (When Connected to IE-V850E-MC-A)..........12 System Specifications of IE-703107-MC-EM1 (When Connected to IE-V850E-MC-A)..13 System Configuration.........................14 Contents in Carton........................17 Connection Between IE-V850E-MC-A and IE-703107-MC-EM1..........18 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS ............20 Names and Functions of IE-703107-MC-EM1 Components ............21 Clock Settings ..........................23...
  • Page 11 Notes on Handling LSPACK/CSSOCKET (FBGA Package)............78 APPENDIX D INSERTING PLASTIC SPACER ..................79 APPENDIX E REVISION HISTORY ......................80 User’s Manual U14481EJ3V0UM...

  • Page 12: Chapter 1 Overview

    703107-MC-EM1 to IE-V850E-MC-A, hardware and software can be debugged efficiently in system development using the V850E/MA1 and V850E/MA2. In this manual, the basic setup sequences and switch settings of the IE-703107-MC-EM1 when connecting it to the IE-V850E-MC-A are described. For the names and functions of the parts of the IE-V850E-MC-A, and for the connection of elements, refer to the IE-V850E-MC, IE-V850E-MC-A User’s Manual (U14487E) which is a separate...

  • Page 13: Hardware Configuration

    CHAPTER 1 OVERVIEW 1.1 Hardware Configuration Separately-sold hardware In-circuit emulator (IE-V850E-MC-A) Option board IE-V850E-MC-A can be used as in-circuit emulator for (IE-703107-MC-EM1) V850E/MA1 and V850E/MA2 by adding this board. Separately-sold hardware Extension probes General-purpose extension probes made by TOKYO ELETECH CORPORATION.

  • Page 14: Hardware Specifications (When Connected To Ie-V850E-Mc-A)

    CHAPTER 1 OVERVIEW 1.2 Hardware Specifications (When Connected to IE-V850E-MC-A) Table 1-1. Hardware Specifications Parameter Value µ Target device V850E/MA1 PD703103AGJ-UEN µ PD703105AGJ-xxx-UEN µ PD703106AGJ-xxx-UEN µ PD703107AGJ-xxx-UEN µ PD70F3107AGJ-UEN µ PD703106AF1-xxx-EN4 µ PD703107AF1-xxx-EN4 µ PD70F3107AF1-EN4 µ PD703106AGJ(A)-xxx-UEN µ PD703107AGJ(A)-xxx-UEN µ PD70F3107AGJ(A)-xxx-UEN µ...

  • Page 15: System Specifications Of Ie-703107-Mc-Em1 (When Connected To Ie-V850E-Mc-A)

    CHAPTER 1 OVERVIEW 1.3 System Specifications of IE-703107-MC-EM1 (When Connected to IE-V850E-MC-A) Table 1-2. System Specifications of IE-703107-MC-EM1 (When Connected to IE-V850E-MC-A) Parameter Specification Emulation memory Internal ROM 1 MB (Max.) capacity External memory 4 MB (Max.) Execution/pass detection Internal ROM 1 MB (Max.)

  • Page 16: System Configuration

    CHAPTER 1 OVERVIEW 1.4 System Configuration The system configuration when connecting the IE-703107-MC-EM1 to the IE-V850E-MC-A, which is then connected to a personal computer (PC-9800 series, PC/AT or compatible) is shown below. • V850E/MA1 (144-pin LQFP): Refer to Figure 1-1.
  • Page 17 <3> PC interface board (IE-70000-PCI-IF(-A), IE-70000-CD-IF-A: sold separately) <4> PC interface cable (included with IE-V850E-MC-A) <5> In-circuit emulator (IE-V850E-MC-A: sold separately) <6> In-circuit emulator option board (IE-703107-MC-EM1: this product) <7> External logic probe (included with IE-703107-MC-EM1) <8> Extension probe (SC-144SDN, SWEX-144SD-1: sold separately) <9>...
  • Page 18 <3> PC interface board (IE-70000-PCI-IF(-A), IE-70000-CD-IF-A: sold separately) <4> PC interface cable (included with IE-V850E-MC-A) <5> In-circuit emulator (IE-V850E-MC-A: sold separately) <6> In-circuit emulator option board (IE-703107-MC-EM1: this product) <7> External logic probe (included with IE-703107-MC-EM1) <8> 144-pin to 100-pin conversion adapter (VP-V850E/MA1-MA2: sold separately) <9>...

  • Page 19: Contents In Carton

    1.5 Contents in Carton The carton of the IE-703107-MC-EM1 contains the main unit, a guarantee card, a packing list, and an accessory bag. Make sure that the accessory bag contains this manual and connector accessories. In the case of missing or damaged items, contact an NEC Electronics sales representative or distributor.

  • Page 20: Connection Between Ie-V850E-Mc-A And Ie-703107-Mc-Em1

    <2> Set the PGA socket lever of the IE-703107-MC-EM1 to the OPEN position as shown in Figure 1-5 (b). <3> Connect the IE-703107-MC-EM1 to the PGA socket at the rear of the POD (refer to Figure 1-5 (c)). When connecting, position the IE-V850E-MC-A and IE-703107-MC-EM1 so that they are horizontal.
  • Page 21 CHAPTER 1 OVERVIEW Figure 1-5. Connection Between IE-V850E-MC-A and IE-703107-MC-EM1 (2/2) (b) PGA socket lever of IE-703107-MC-EM1 CLOSE OPEN (c) Connecting part (IE-703107-MC-EM1) Pin A1 location : Insertion guide pin : IE-V850E-MC-A insertion area User’s Manual U14481EJ3V0UM...

  • Page 22: Chapter 2 Names And Functions Of Components

    CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS This chapter describes the names, functions, and switch settings of components comprising the IE-703107-MC- EM1. For the details of the pod, jumper, and switch positions, etc., refer to the IE-V850E-MC, IE-V850E-MC-A User’s Manual (U14487E). User’s Manual U14481EJ3V0UM...

  • Page 23: Names And Functions Of Ie-703107-Mc-Em1 Components

    CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2.1 Names and Functions of IE-703107-MC-EM1 Components Figure 2-1. IE-703107-MC-EM1 Direction of pin 1 of the connector for target connection Connector for Connector for target connection target connection DIRECT D70F3107 Connector for connecting...
  • Page 24 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS (1) Test pins (TP1 to TP7) To leave the DMA cycle or refresh cycle in the tracer, or cause a break, connect these pins to the external logic probe. • TP1: GND • TP2: REFRQ •...

  • Page 25: Clock Settings

    (1) Use the crystal oscillator mounted on the IE-703107-MC-EM1 as the internal clock. (2) Change the crystal oscillator mounted on the IE-703107-MC-EM1 and use it as the internal clock. (3) Use the crystal oscillator on the target system as an external clock.

  • Page 26: Clock Setting Methods

    CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2.2.2 Clock setting methods A list of the hardware settings for each clock setting is shown below. Table 2-1. List of Hardware Settings for Each Clock Setting Type of Clock Used Clock Source OSC Crystal JP1 Setting Clock...
  • Page 27 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS (1) Using the crystal oscillator (OSC) mounted on the IE-703107-MC-EM1 as the internal clock <1> Mount the 5.000 MHz crystal oscillator mounted at factory shipment in the OSC socket of the IE-703107- MC-EM1 (with the default settings).
  • Page 28 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS (2) Changing the crystal oscillator (OSC) mounted on the IE-703107-MC-EM1 and using it as the internal clock <1> Remove the crystal oscillator (OSC) that is mounted on the IE-703107-MC-EM1 and mount the oscillator to be used.
  • Page 29 Caution Be sure to input a square wave to the X1 pin. When a clock generated by a crystal/ceramic resonator is used, the IE-703107-MC-EM1 does not operate. Figure 2-5. Outline When Using Crystal Oscillator on Target System as External Clock...

  • Page 30: Operation Mode Settings

    To operate the emulator in the ROMless mode, be sure to map the emulation memory or the memory on the target system from address 0H. Note that the IE-703107-MC-EM1 cannot emulate the MODE pin because the level input to the MODE pin is realized by the pin mask function of the debugger.

  • Page 31: Power Supply Settings

    ) is set by using JP2. 2.4.1 JP2 setting when emulator operates as stand-alone unit When JP2 is set as shown in Figure 2-6, the IE-703107-MC-EM1 detects the power on the target system side and automatically selects whether V is supplied from the internal power supply of the emulator or from the target system (with the default settings).

  • Page 32: Emulation Memory

    This is a substitute memory used to emulate the memory or memory mapped I/O on the target system (capacity: 4 MB). The emulation memory is mounted on the IE-703107-MC-EM1. 2.5.1 Wait setting for emulation memory The data wait, address wait, and idle state for the emulation memory are set as follows.

  • Page 33: Cautions Related To Emulation Memory

    CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2.5.2 Cautions related to emulation memory (1) Number of data waits required for emulation memory access The number of data waits required to be inserted for emulation memory access varies depending on the operating frequency of the emulator.

  • Page 34: Chapter 3 Factory Settings

    CHAPTER 3 FACTORY SETTINGS Item Setting Remark All settings other than those set in the factory are prohibited. Detects the power of the target system and automatically selects whether V is supplied from the internal power supply of the emulator or from the target system.

  • Page 35: Chapter 4 Cautions

    CHAPTER 4 CAUTIONS 4.1 Cautions on Terminating Pins The pins that perform special processing in the emulator are explained below. For detailed circuit configuration, refer to CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS. (1) Pins that cannot be emulated The following pins cannot be emulated because they are left open inside the emulator or connected to 3.3 V or GND via resistor.

  • Page 36: Notes On Internal Ram

    With this setting of JP2, the emulator does not operate if the target system is not connected. However, sneaking of power can be avoided. Figure 4-1. Schematic Diagram of Power Supply Flow IE-703107-MC-EM1 IE-V850E-MC Target system µ...

  • Page 37: Chapter 5 Differences Between Target Devices And Target Interface Circuits

    CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS This chapter shows the internal equivalent circuits of the emulator signals to be connected to the target system. Some pins cannot be emulated because of the internal processing of the emulator (refer to CHAPTER 4 CAUTIONS). The equivalent circuits are shown in Figures 5-1 to 5-10.
  • Page 38 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-2. Corresponding Pin List (Pin Equivalent Circuit 2) (1/5) Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device Pin No. V850E/MA1 (144-pin LQFP) − −...
  • Page 39 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-2. Corresponding Pin List (Pin Equivalent Circuit 2) (2/5) Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device Pin No. V850E/MA1 (144-pin LQFP) − −...
  • Page 40 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-2. Corresponding Pin List (Pin Equivalent Circuit 2) (3/5) Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device Pin No. V850E/MA1 (144-pin LQFP) − −...
  • Page 41 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-2. Corresponding Pin List (Pin Equivalent Circuit 2) (4/5) Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device Pin No. V850E/MA1 (144-pin LQFP) − −...
  • Page 42 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-2. Corresponding Pin List (Pin Equivalent Circuit 2) (5/5) Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device Pin No. V850E/MA1 (144-pin LQFP) − −...
  • Page 43 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5-3. Pin Equivalent Circuit 3 3.3 V 33 kΩ Emulation CPU RESET Table 5-3. Corresponding Pin List (Pin Equivalent Circuit 3) Pin Name 1 Target Device Pin No. V850E/MA1 (144-pin LQFP) RESET V850E/MA1 (161-pin FBGA) V850E/MA2 (100-pin LQFP)
  • Page 44 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5-5. Pin Equivalent Circuit 5 , MODE2, OPEN X2, NC Table 5-5. Corresponding Pin List (Pin Equivalent Circuit 5) Pin Name 1 Pin Name 2 Package Pin No. V850E/MA1 (144-pin LQFP) −...
  • Page 45 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-6. Corresponding Pin List (Pin Equivalent Circuit 6) (2/4) Pin Name 1 Pin Name 2 Pin Name 3 Target Device Pin No. V850E/MA1 (144-pin LQFP) DMARQ0 INTP100 V850E/MA1 (161-pin FBGA) V850E/MA2 (100-pin LQFP) V850E/MA1 (144-pin LQFP) DMARQ1...
  • Page 46 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-6. Corresponding Pin List (Pin Equivalent Circuit 6) (3/4) Pin Name 1 Pin Name 2 Pin Name 3 Target Device Pin No. V850E/MA1 (144-pin LQFP) INTP112 V850E/MA1 (161-pin FBGA) −...
  • Page 47 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5-6. Corresponding Pin List (Pin Equivalent Circuit 6) (4/4) Pin Name 1 Pin Name 2 Pin Name 3 Target Device Pin No. V850E/MA1 (144-pin LQFP) TXD1 V850E/MA1 (161-pin FBGA) V850E/MA2 (100-pin LQFP) V850E/MA1 (144-pin LQFP) RXD1...
  • Page 48 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5-7. Pin Equivalent Circuit 7 When external clock is selected 74HC157 µ PD70F3107 33 kΩ When internal clock is selected 33 kΩ Table 5-7. Corresponding Pin List (Pin Equivalent Circuit 7) Pin Name 1 Package Pin No.
  • Page 49 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5-9. Pin Equivalent Circuit 9 MODE0 33 kΩ Table 5-9. Corresponding Pin List (Pin Equivalent Circuit 9) Pin Name 1 Package Pin No. V850E/MA1 (144-pin LQFP) MODE0 V850E/MA1 (161-pin FBGA) V850E/MA2 (100-pin LQFP) Figure 5-10.

  • Page 50: Appendix A Dimensions

    APPENDIX A DIMENSIONS A.1 Corresponding Package Dimensions (1) IE-V850E-MC-A + IE-703107-MC-EM1 (Unit: mm) Top view Pin 1 direction Side view IE-V850E-MC-A IE-703107-MC-EM1 Bottom view 206.6 15.88 Top view 29.0 User’s Manual U14481EJ3V0UM...
  • Page 51 APPENDIX A DIMENSIONS (2) SC-144SDN (Unit: mm) User’s Manual U14481EJ3V0UM...
  • Page 52 APPENDIX A DIMENSIONS (3) SC-100SDN (Unit: mm) User’s Manual U14481EJ3V0UM...
  • Page 53 APPENDIX A DIMENSIONS (4) SWEX-100SD-1 (Unit: mm) (48) (295±8) (48) SWEX-100SD1 Target MADE IN JAPAN JAPAN (20) (20) Black (45) Ground Wire User’s Manual U14481EJ3V0UM...
  • Page 54 APPENDIX A DIMENSIONS (5) SWEX-144SD-1 (Unit: mm) (55.5) (55.5) (295±8) SWEX-144SD-1 Target JAPAN MADE IN JAPAN (24) (24) Black (45) Ground Wire User’s Manual U14481EJ3V0UM...
  • Page 55 APPENDIX A DIMENSIONS (6) NQPACK144SD (Unit: mm) [Top View] 27.0 × 5 = 0.55 17.5 3 R1.5 C1.5 φ 1.0 20.1 [Side View] 0.18 21.05 [Bottom View] 23.0 12.0 φ 2.0 Height of projection1.8 User’s Manual U14481EJ3V0UM...
  • Page 56 APPENDIX A DIMENSIONS (7) YQPACK144SD (Unit: mm) [Top View] 22.65 0.5 × 35 φ = 17.5 C2.0 φ 3 R2.5 4 R1.5 [Side View] × 0.25 0.25 [Bottom View] 22.8 C1.5 19.6 User’s Manual U14481EJ3V0UM...
  • Page 57 APPENDIX A DIMENSIONS (8) HQPACK144SD (Unit: mm) [Top View] ± 0.15 22.65 ± × 35 = 17.5 φ ± C2.0 φ 3 R2.5 4 R1.5 [Side View] 0.25 [Bottom View] 22.8 C1.5 19.6 User’s Manual U14481EJ3V0UM...
  • Page 58 APPENDIX A DIMENSIONS (9) NQPACK100SD (Unit: mm) [Top View] 21.0 0.5 × 24 = 12.0 C 1.5 Slit width 3 − 1.0 + 0.1 − 0 14.0 [Side View] 0.18 15.0 [Bottom View] 17.0 4 − 2.0 Projection height 1.8 User’s Manual U14481EJ3V0UM...
  • Page 59 APPENDIX A DIMENSIONS (10) YQPACK100SD (Unit: mm) [Top View] 16.6 0.5 × 24 = 12.0 3 – 1.0 10.9 13.3 15.7 18.1 [Side View] 0.25 × 0.3 0.25 [Bottom View] C 1.5 13.4 User’s Manual U14481EJ3V0UM...
  • Page 60 APPENDIX A DIMENSIONS (11) HQPACK100SD (Unit: mm) [Top View] 16.6 0.5 × 24 = 12.0 3 – 1.0 [Side View] 0.23 0.58 [Bottom View] C 1.5 13.4 User’s Manual U14481EJ3V0UM...
  • Page 61 APPENDIX A DIMENSIONS (12) VP-V850E/MA1-MA2 (Unit: mm) [Top View] M401958/A 1PIN VP-V850E/MA1-MA2 JAPAN [Side View] User’s Manual U14481EJ3V0UM...
  • Page 62 APPENDIX A DIMENSIONS (13) CSSOCKET161A1413N01N (Unit: mm) [Top View] 0.8 × 13 = 10.4 1.6 1.2 11.8 [Side View] φ 0.25 φ 0.55 User’s Manual U14481EJ3V0UM...
  • Page 63 APPENDIX A DIMENSIONS (14) CSSOCKET161A1413N01 (Unit: mm) [Top View] 0.8 × 13 = 10.4 1.6 1.2 11.8 [Side View] φ 0.48 φ φ 0.48 0.25 φ φ 0.65 0.55 User’s Manual U14481EJ3V0UM...
  • Page 64 APPENDIX A DIMENSIONS (15) CSSOCKET161A1413N01S1 (Unit: mm) [Top View] 0.8 × 13 = 10.4 1.6 1.2 11.8 [Side View] φ 0.25 φ 0.55 User’s Manual U14481EJ3V0UM...
  • Page 65 APPENDIX A DIMENSIONS (16) CSICE161A1413N02 (Unit: mm) [Top View] 22.65 0.5 × 35 = 17.5 Pin 1 direction φ 4 − 2.2 Component hole [Side View] φ 1.03 φ 0.32 [Bottom View] 0.8 × 13 = 10.4 161-Soldering φ 161-Land diameter: 0.5 φ...
  • Page 66 APPENDIX A DIMENSIONS (17) LSPACK161A1413N01 (CSICE, without device mounting cover) (Unit: mm) [Top View] [Side View] [Bottom View] 22.65 0.8 × 13 = 10.4 LSPACK161A TET MADE IN JAPAN User’s Manual U14481EJ3V0UM...
  • Page 67 APPENDIX A DIMENSIONS (18) LSPACK161A1413N01 (with device mounting cover) (Unit: mm) [Top View] [Side View] [Bottom View] User’s Manual U14481EJ3V0UM...

  • Page 68: Conditions For Connecting Of In-Circuit Emulator Option Board And Conversion Connector

    Design your system making allowances for conditions such as the form of parts mounted on the target system as shown below. (1) V850E/MA1, 144-pin plastic LQFP (fine pitch) (20 × 20) Side View In-circuit emulator In-circuit emulator IE-V850E-MC-A option board IE-703107-MC-EM1 Conversion connector 206.26 mm YQGUIDE Note YQPACK144SD NQPACK144SD Target system Note The YQSOCKET144SDN (sold separately) can be inserted here to adjust the height (height: 3.2 mm).
  • Page 69 APPENDIX A DIMENSIONS (2) V850E/MA1, 161-pin plastic FBGA (13 × 13) Side View In-circuit emulator In-circuit emulator IE-V850E-MC-A option board IE-703107-MC-EM1 Conversion connector 206.26 mm CSICE161A1413N02 LSPACK161A1413N01 Target system Note 2 CSSOCKET161A1413N01N Note 1 Notes 1. The CSSOCKET161A1413N01S1 (sold separately) can be inserted here to adjust the height (height: 3.2 mm).
  • Page 70 APPENDIX A DIMENSIONS (3) V850E/MA2, 100-pin plastic LQFP (fine pitch) (14 × 14) Side View In-circuit emulator In-circuit emulator IE-V850E-MC-A option board IE-703107-MC-EM1 Conversion connector 206.26 mm VP-V850E/MA1-MA2 YQGUIDE Note YQPACK100SD NQPACK100SD Target system Note The YQSOCKET100SDN (sold separately) can be inserted here to adjust the height (height: 3.2 mm).

  • Page 71: Appendix B Example Of Use Of Connector For Target Connection

    APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION (1) When directly connecting device to target system (connector for target connection is not used) Device Target system (2) When connecting device using connector for target connection (a) LQFP package Fastening screws HQPACK144SD (V850E/MA1, 144-pin LQFP) HQPACK100SD (V850E/MA2, 100-pin LQFP)

  • Page 72: Appendix C Connectors For Target Connection

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.1 Usage (LQFP Package) (1) When mounting NQPACK144SD on target system <1> Coat the tip of the four projections (points) at the bottom of the NQPACK144SD or NQPACK100SD with two-component type epoxy adhesive (cure time longer than 30 minutes) and bond the NQPACK144SD or NQPACK100SD to the target system.
  • Page 73 APPENDIX C CONNECTORS FOR TARGET CONNECTION (2) When mounting device Caution Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK144SD or NQPACK100SD. Moreover, check that the hold pins of the HQPACK144SD or HQPACK100SD are not broken or bent before mounting the HQPACK144SD or HQPACK100SD on top of the device.

  • Page 74: Cautions On Handling Connectors (Lqfp Package)

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.2 Cautions on Handling Connectors (LQFP Package) (1) When taking connectors out of the case, remove the sponge while holding the main unit. (2) When soldering the NQPACK144SD or NQPACK100SD to the target system, cover with the HQPACK144SD or HQPACK100SD to protect it against splashing flux.

  • Page 75: Notes On Board Design (Fbga Package)

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.3 Notes on Board Design (FBGA Package) (1) If a through hole is made in an IC pad or nearby, the cream solder melts and flows into the hole, causing open pins. (2) When making a through hole in an IC pad, fill the hole. (3) If it is necessary to make a through hole near an IC pad, be sure to apply resist between the pad and through hole as shown in Figure C-4 (a).

  • Page 76: Soldering Cssocket (Main Enclosure Connector) To Target Board (Fbga Package)

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.4 Soldering CSSOCKET (Main Enclosure Connector) to Target Board (FBGA Package) (1) Apply cream solder to the BGA pad of the target board. The thickness of the cream solder on the pad should be µ...
  • Page 77 APPENDIX C CONNECTORS FOR TARGET CONNECTION Figure C-6. Example of Mounting Profile of CSSOCKET CSSOCKET180A (Dimensions: 13 × 13 mm) CSSOCKET bottom side Any point on board (soldering side) CSSOCKET top side 35 seconds at more than 183°C Peak: 195°C •...

  • Page 78: Using Lspack To Mount Ic (Fbga Package)

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.5 Using LSPACK to Mount IC (FBGA Package) Attach LSPACK to CSSOCKET, which has already been soldered, using the guide plate, spacer, and top cover. (1) Align the guides of CSSOCKET and LSPACK, and attach LSPACK to CSSOCKET. (2) Place the guide plate (included with models released after November 2000) and spacer, in that order, on LSPACK.

  • Page 79: Connecting In-Circuit Emulator (Fbga Package)

    APPENDIX C CONNECTORS FOR TARGET CONNECTION C.6 Connecting In-Circuit Emulator (FBGA Package) CSICE connector: Conversion adapter to connect an existing tool supporting TQPACK/NQPACK (QFP) and LSPACK (Conversion from BGA to QFP). Also for conversion to different pitches of BGA. Attach LSPACK to CSSOCKET, which has already been soldered, using the guide plate, spacer, and top cover. (1) Place the pad side of the CSICE connector on LSPACK.
  • Page 80 APPENDIX C CONNECTORS FOR TARGET CONNECTION C.7 Notes on Handling LSPACK/CSSOCKET (FBGA Package) Caution When mounting CSSOCKET for the first time, refer to C.3 Notes on Board Design (FBGA Package), and C.4 Soldering CSSOCKET (Main Enclosure Connector) to Target Board (FBGA Package).
  • Page 81 APPENDIX D INSERTING PLASTIC SPACER This chapter describes the method for inserting the plastic spacer supplied with the IE-V850E-MC-A. When using the emulator connected to the target system, insert the plastic spacer in the IE-V850E-MC-A as shown in Figure D-1 to fix the pod horizontally. •...
  • Page 82 Change of 1.2 Features (When Connected to IE-V850E-MC-A) to 1.2 Hardware Specifications (When Connected to IE-V850E-MC-A) Change of 1.3 Function Specifications (When Connected to IE-V850E-MC-A) to 1.3 System Specifications of IE-703107-MC-EM1 (When Connected to IE-V850E- MC-A) Change of Figure 1-1 System Configuration to Figure 1-1 System Configuration...
  • Page 83 APPENDIX E REVISION HISTORY (2/2) Edition Major Revision from Previous Edition Applied to: 2nd edition Addition of CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET CHAPTER 5 INTERFACE CIRCUITS DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS A.1 Corresponding Package Dimensions APPENDIX A •...

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