Huawei MU709s-2 Hardware Manual page 34

HUAWEI MU709s-2 HSPA+ Mini PCIe Module
Hardware Guide
Item
High-temperature
storage
Low-temperature
operating
High-temperature
operating
Damp heat
cycling
Thermal shock
Issue 02 (2014-09-18)
Test Condition
 Temperature: 85ºC

Operation mode: no
power, no package
 Test duration: 24 h
 Temperature: –30ºC

Operation mode:
working with service
connected
 Test duration: 24 h
 Temperature: 70ºC

Operation mode:
working with service
connected

Test duration: 24 h
 High temperature:
55ºC
 Low temperature:
25ºC

Humidity: 95%±3%
 Operation mode:
working with service
connected
 Test duration: 6
cycles; 12 h+12
h/cycle
 Low temperature:
–40ºC
 High temperature:
85ºC

Temperature change
interval: < 20s
 Operation mode: no
power

Test duration: 100
cycles; 15 Min+15
Min/cycle
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Electrical and Reliability Features
Standard Sample size
JESD22- 3 pcs/group
A103-C
IEC60068 3 pcs/group
-2-1
JESD22- 3 pcs/group
A108-C
JESD22- 3 pcs/group
A101-B
JESD22- 3 pcs/group
A106-B
Results
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
Visual inspection: ok
Function test: ok
RF specification: ok
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