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User's Guide
TPS62869EVM-118 Evaluation Module
This user's guide describes the characteristics, operation, and use of TI's evaluation module (EVM) for the
TPS628691, TPS628692, TPS628681, TPS628682 devices. The TPS62869EVM-118 (BSR118) facilitates the
evaluation of the TPS62869 family of 6-A, step-down converter with DCS-Control
QFN package solution. The EVM creates output voltages between 0.4V and 1.675V with 1% accuracy output
voltages from higher input voltages between 2.4 V and 5.5 V, to a regulated 0.9V output voltage. The TPS62869
family is a highly efficient and tiny solution for point-of-load (POL) converters for space-constrained applications,
such as artificial intelligence chips, camera modules, solid state drives (SSDs), and optical modules.
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Introduction.............................................................................................................................................................................2
1.1 Performance Specification.................................................................................................................................................
1.2 Modifications......................................................................................................................................................................
2
Setup........................................................................................................................................................................................2
2.2 Hardware Setup.................................................................................................................................................................
3 TPS62869EVM-118 Test Results............................................................................................................................................
Layout...........................................................................................................................................................................3
5 Schematic and List of Materials............................................................................................................................................
5.1 Schematic..........................................................................................................................................................................
5.2 List of Materials..................................................................................................................................................................
Interface..........................................................................................................................................................7
Setup...................................................................................................................................................................7
6.2 Interface Hardware Setup..................................................................................................................................................
Operation....................................................................................................................................................7
History......................................................................................................................................................................9
Figure 4-1. Top Assembly............................................................................................................................................................
Layer...................................................................................................................................................................3
Figure 4-3. Signal Layer 1...........................................................................................................................................................
Figure 4-4. Signal Layer 2...........................................................................................................................................................
Figure 4-5. Signal Layer 3...........................................................................................................................................................
Figure 4-6. Signal Layer 4...........................................................................................................................................................
Figure 4-7. Bottom Layer.............................................................................................................................................................
Figure 6-2. GUI Home Screen.....................................................................................................................................................
Screen..................................................................................................................................................9
SLUUC88B - MARCH 2021 - REVISED NOVEMBER 2021
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ABSTRACT
Table of Contents
List of Figures
List of Tables
Summary..........................................................................................................................2
Materials.............................................................................................................................6
Copyright © 2021 Texas Instruments Incorporated
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