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User's Guide
TPS628690EVM-135 Evaluation Module
This user's guide describes the characteristics, operation, and use of TI's evaluation module (EVM) for
the TPS628690, TPS628680 devices. The TPS628690EVM-135 (BSR135) facilitates the evaluation of the
TPS628690, 6-A step-down converter with DCS-Control
The EVM creates output voltages between 0.2 V and 0.8375 V with 1% accuracy output voltages from higher
input voltages between 2.4 V and 5.5 V. The TPS628690 is a highly efficient and tiny solution for point-of-load
(POL) converters for space-constrained applications, such as artificial intelligence chips, camera modules, solid
state drives (SSDs), LPDDR5 memory, and optical modules.
1
Introduction.............................................................................................................................................................................2
1.1 Performance Specification.................................................................................................................................................
1.2 Modifications......................................................................................................................................................................
2
Setup........................................................................................................................................................................................2
2.2
Setup..................................................................................................................................................................................2
Layout...........................................................................................................................................................................3
5 Schematic and List of Materials............................................................................................................................................
5.1 Schematic..........................................................................................................................................................................
5.2 List of Materials..................................................................................................................................................................
Interface..........................................................................................................................................................6
Setup...................................................................................................................................................................6
6.2 Interface Hardware Setup..................................................................................................................................................
Operation....................................................................................................................................................7
Figure 4-1. Top Assembly............................................................................................................................................................
Layer...................................................................................................................................................................3
Figure 4-3. Signal Layer 1...........................................................................................................................................................
Figure 4-4. Signal Layer 2...........................................................................................................................................................
Figure 4-5. Signal Layer 3...........................................................................................................................................................
Figure 4-6. Signal Layer 4...........................................................................................................................................................
Figure 4-7. Bottom Layer.............................................................................................................................................................
Figure 6-2. GUI Home Screen.....................................................................................................................................................
Screen..................................................................................................................................................8
Trademarks
DCS-Control
™
is a trademark of TI.
All trademarks are the property of their respective owners.
SLUUCH3 - MAY 2021
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ABSTRACT
Table of Contents
Results..........................................................................................................................................3
List of Figures
Schematic...............................................................................................................................5
List of Tables
Summary..........................................................................................................................2
Materials.............................................................................................................................5
Copyright © 2021 Texas Instruments Incorporated
™
in a small 1.5-mm by 2.5-mm QFN package solution.
TPS628690EVM-135 Evaluation Module
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