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Soldering precautions
Should it become necessary to use solder on the circuit board, observe the following
precautions:
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Performance verification
The following paragraphs discuss performance verification procedures for the Model 2000-
SCAN-20, including path resistance, contact potential, and isolation.
NOTE
Environmental conditions
Make all verification measurements at an ambient temperature between 18° and 28°C and at
a relative humidity of less than 70%.
Use an OA-based (organic activated) flux and take care not to spread the flux to other
areas of the circuit board.
Remove the flux from the work areas when the repair has been completed. Use pure
water along with clean cotton swabs or a clean, soft brush to remove the flux.
Once the flux has been removed, swab only the repaired area with methanol and then
blow dry the board with dry nitrogen gas.
After cleaning, allow the card to dry in a 50°C low-humidity environment for several
hours before use.
Contamination will degrade the performance of the card. To avoid contamination,
always grasp the card by the side edges. Do not touch connector insulators, board
surfaces, or components.
Failure of any performance verification test may indicate that the scanner card is con-
taminated. See "Handling and cleaning precautions" in this section for information
on cleaning the card.
Service Information
4-3
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