Elenco Electronics FG-600K Assembly And Instruction Manual page 5

Assemble Surface Mount Components
The most important factor in assembling your FG-600 Function Generator Kit is good soldering techniques.
Using the proper soldering iron is of prime importance. A small pencil type iron of 10-15 watts is recommended.
A sharply pointed tip is essential when soldering surface mount components. The tip of the iron should be kept
clean and well tinned at all times. Many areas on the printed circuit board are close together and care must be
given not to form solder shorts. Solder shorts may occur if you accidentally touch an adjacent foil, particularly
a previously soldered connection, using too much solder, or dragging the iron across adjacent foils. If a solder
short occurs, remove it with your hot iron. Use only rosin core solder of 60/40 alloy. Before soldering the FG-
600 board should be taped to the workbench to keep it from moving when touched with the soldering iron. For
a good soldering job, the areas being soldered must be heated sufficiently so that the solder flows freely. When
soldering surface mount resistors and capacitors, the following procedure may be used:
1. Using tweezers, place the surface mount component on the PC board
pads and secure in place with tape.
2. Apply a small amount of solder to the soldering iron tip. This allows the
heat to leave the iron and flow onto the foil.
3. Place the iron in contact with the PC board foil. Apply a small amount of
solder simultaneously to the foil and the component and allow them to
melt the solder.
4. Remove the iron and allow the solder to cool. The solder should have flowed freely and not lump up around
the component.
5. Remove the tape and solder the other side of the component.
When soldering the transistors, diodes and integrated circuits, the following procedure may be used:
1. Place the component on the PC board pads and secure in place with tape.
2. Apply a small amount of solder to the soldering iron tip.
3. Place the soldering iron tip on top of the component lead to be soldered and apply solder simultaneously to
the lead and the PC board foil.
4. Remove the iron and allow the solder to cool. The solder should have
flowed freely and not lump up around the component.
After a component is completely soldered, each solder joint should be
inspected with a magnifying glass. If the solder has not flowed smoothly, a
bad solder joint is indicated. This occurs when the component and pad have
not been heated sufficiently. To correct, reheat the connection and if
necessary add a small amount of additional solder.
Another way to solder surface mount components is as follows:
1. Apply a small amount of solder to the soldering iron tip.
2. Using tweezers, hold the component on the PC board pads.
3. Apply the soldering iron simultaneously to the component and pad and
allow the solder to flow around the component.
4. Remove the soldering iron and allow the connection to cool.
-4-
Tape
Iron
Solder
Tweezers
Iron
Solder