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HSPA/UMTS/GSM/GPRS Module Series
UG96&UG95&M95 R2.0 Compatible Design
5.2. Recommended Stencil Design
UG96, UG95 and M95 R2.0 have different PCB thicknesses. In order to ensure the module soldering
quality, the thickness of stencil is recommended to be 0.13mm for UG96/UG95 and 0.2mm for M95 R2.0.
For more details, please refer to document [6].
The recommended stencil design of UG96 is shown as below.
Figure 21: Recommended Stencil Design of UG96
UG96&UG95&M95 R2.0_Compatible_Design
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