Operating temperature of main parts ..................... 8 7.2. How to measure the temperature of the device surface ................8 7.3. <Reference> surface temperature of each device in the CIS chassis (29mm×29mm×77mm)......9 GenLock ..............................9 LTC (Longitudinal Time code) ........................9 Defective Pixel Correction .......................... 10 10.1.
Assembly without appropriate heat dissipation may cause damages or malfunction. Product Outline DCC-HD3 is provided as an assembly unit that is a part of CIS full HD color camera module with Gen Lock function, VCC-HD3, utilizing a 1/3 type MOS image sensor.
DCC-HD3 Rev. 905-0118-00 7.3. <Reference> surface temperature of each device in the CIS chassis (29mm×29mm×77mm) 25℃ 40℃ 45℃ Ambient temperature Image sensor FPGA 55.7 70.7 75.7 51.7 66.7 71.7 SDI IC 55.1 70.1 75.1 GenLock Input analog external sync signals (black burst or 3-value SYNC) to the EXT SYNC IN terminal of 6pins connector to enable Gen Lock function.
CIS Corporation, at its option, repairs or replaces it at no charge to you. Products out of warranty period will be subject to charge. CIS repairs the products as long as it is repairable. CIS shall be exempted from taking responsibility and held harmless for damages or losses incurred by the following cases.
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