HP ProDesk 600 G4 SFF Business Disassembly Instructions Manual page 2

Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Star screwdriver
Cross screwdriver
Cross screwdriver
Hexagon socket wrench
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove side panel
2. Remove front bezel
3. Unplug ODD & HDD cables
4. Remove drive cage
5. Remove FIO cage
6. Remove ODD & HDD
7. Release all cables
8. Remove fan duct
9. Remove cooler
10. Remove CPU
11. Remove Memory
12. Remove WLAN module
13. Remove SSD module
14. Remove all PCIEXP cards
nd
15. Remove 2 serial card
16. Remove option card
17. Remove card reader
18. Remove antenna cable
19. Remove MB and bettery
20. Remove PSU
21. Remove speaker
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00
Template Revision B
PSG instructions for this template are available at EL-MF877-01
0
Tool Size (if
applicable)
OD 3.3mm
OD 3.0mm
OD 6.0mm
4.6mm
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