Memories; Mad Memory Configuration; Memory; Program And Data Memory - Nokia NSM-3 Series Technical Documentation Manual

System module
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PAMS Technical Documentation

Memories

MAD memory configuration

The MAD2WD1 used in NSM–3 phones contains 16 kW RAM, and 80 kW
ROM memory.

Memory

The MCU program code resides in an external flash program memory,
which size is 16Mbits (1024k x 16bit). The MCU work (data) memory size
is 2048 kbits (256k x 16bit). Flash and SRAM memory chips are packed
in same combo memory package.
The BusController (BUSC) section in the MAD decodes the chip select
signals for the external memory devices and the system logic. BUSC con-
trols internal and external bus drivers and multiplexers connected to the
MCU data bus. The MCU address space is divided into access areas with
separate chip select signals. BUSC supports a programmable number of
wait states for each memory range.

Program and Data Memory

The MCU program code resides in the program memory. The program
memory is 16Mbits (1024k x 16bit) Flash memory.
The flash memory has a power down pin that should be kept low, during
the power up phase of the flash to ensure that the device is powered up
in the correct state, read only. The power down pin is utilized in the sys-
tem sleep mode by connecting the ExtSysResetX to the flash power down
pin to minimize the flash power consumption during the sleep.
Nonvolatile data memory is implemented with program (Flash) memory.
Special EEPROM emulation (EEEMmu) software is utilized.

Work Memory

The work memory is a static RAM of size 2096k (256k x 16). The memory
contents are lost when the baseband voltage is switched off. All retainable
data must be stored into the data memory when the phone is powered
down.

MCU Memory Requirements

Device
FLASH
SRAM

MCU Memory Map

MAD2 supports maximum of 4GB internal and 4MB external address
space. External memories use address lines MCUAd0 to MCUAd21 and
Issue 4 02/2002
Organization Access Time ns
1024kx16
120
256kx16
120
E Nokia Corporation
System Module
Wait States Used
Remarks
1
uBGA 48
1
uBGA 48
NSM–3/3D
Page 35

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