Layout Description; Pcb Stack-Up Summary - Flex BMR474 ROA User Manual

R10,R11,R12
R14,R15
R17,R18
11

Layout description

The following sections describe how the layout guidelines provided in the ROA
128 6016. Technical Specification have been applied to the reference board
layout. The purpose is to give the reader a better understanding of the guidelines
by examples. Please note that every system is different and that there may well
be considerations to make which are not provided here, depending on the system
requirements and limitations set in the end application
11.1

PCB stack-up summary

Layer
Top layer
Layer 2
Layer 3
Bottom layer
28701-ROA1286016 Rev A
R23
R31
T1,T2
D1
Description
VIN, VOUT, PGND planes
Component footprints, signal traces
VOUT, PGND plane, signal traces
VIN, VOUT, PGND planes
VIN, VOUT, PGND planes
Component footprints, signal traces
2021/4/25
162kohm 1% 0603 0.1W,RESISTOR, -55C~155C
1
412kohm 1% 0603 0.1W,RESISTOR, -55C~155C
1
10kohm 1% 0603 0.1W,RESISTOR, -55C~155C
3
180ohm 1% 0603 0.1W,RESISTOR, -55C~155C
2
100kohm 1% 0603 0.1W,RESISTOR, -55C~155C
2
nfet_d3-g1-s2, BSS123, sot23
2
VS-43CTQ100SPBF,100V,2x20A,
D2PAK(TO-263AB)
1
Thickness
2 oz
2 oz
2 oz
2 oz
12 (19)