Esd Precautions; Introduction To Intel - Supermicro X12 Series User Manual

Memory Support for the X12 Series Motherboards
This document provides the user with an easy-to-use guide for proper memory configuration
and installation for the X12 Series motherboards utilizing 3DS LRDIMM/LRDIMM/3DS
RDIMM/RDIMM DDR4 (288-pin) ECC memory with speeds of 3200/2933/2666 memory
modules. (See Note 1 and Note 2 below.)
Note 1: This memory configuration user's guide is written for Supermicro X12UP/DP/
MP motherboards based on the 3rd Gen Intel® Xeon Scalable (83xx/63xx/53xx/4314
Series) processors. Memory support information for the X12ST Series motherboards
is not included in this user's guide since these motherboards are not built upon the
processors indicated above.
Note 2: DDR4 3200 MHz memory is supported by the 3rd Gen Intel Xeon Scalable
83xx/63xx Series Processors only.
To ensure proper memory installation, please carefully follow the information and instructions
provided in this user's guide.

1. ESD Precautions

Electrostatic Discharge (ESD) can damage electronic com ponents including memory modules.
To avoid damaging your DIMM modules, it is important to handle them very carefully. The
following measures are generally sufficient to protect your equipment from ESD.
Precautions
•
Use a grounded wrist strap designed to prevent static discharge.
•
Handle the memory module by its edges only.
•
Put the memory modules into the antistatic bags when not in use.
•
Check the Supermicro website for recommended memory modules

2. Introduction to Intel

(PMem) 200 Series
®
The Intel Optane
TM
3rd Gen Intel Xeon Scalable (83xx/63xx/53xx/4314 Series) Processors. PMem offers data
persistence with higher capacity at similar latencies to the existing memory modules and
provides hyper-speed storage capability for high performance computing platforms with
flexible configuration options.
Optane
®
Persistent Memory (PMem) 200 Series technology is supported by the
DIMM Population Guidelines DIMM Population Guidelines
Persistent Memory
TM
3