LG -D175F Service Manual page 262

Level Location No.
6 R500 Resistor,Chip
C1622 Inductor
6
L1114 Multilayer,Chip
C6700
C6701 Capacitor
6
D6700 Ceramic,Chip
D6701
ZD5400
6 Diode,TVS
ZD6605
6 J6610 Jack,Phone
Capacitor(High
6 C1612 Frequency),Cerami
c,Chip
IC,Digital
6 U2100 Baseband
Processor,3G
R2202
6 Resistor,Chip
R2203
C1116 Capacitor
6
C1603 Ceramic,Chip
Inductor,Wire
6 L4111
Wound,Chip
6 FB5100 Filter,Bead
L1104
Inductor
6 L1110
Multilayer,Chip
L5303
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
ERHZ0000500
ELCH0001054
ECCH0000151
EAH62032801
EAG63070601
EAE62883601
EAN62797001
ERHY0009516
EAE62502901
EAP62266501
EAM62471001
ELCH0004715
Spec
MCR01MZP5J620 62OHM 5% 1/16W 1005 R/TP -
ROHM.
1005GC2T5N6SLF 5.6NH 0.3NH - 300mA
0.27OHM 3.2GHZ 8 SHIELD NONE
1.0X0.5X0.5MM R/TP PILKOR ELECTRONICS
LTD.
CL05B472KB5NNNC 4.7nF 10% 25V X7R -
55TO+125C 1005 R/TP - - SAMSUNG ELECTRO-
MECHANICS CO., LTD.
RCLAMP0531T 5V 6V min. 20V 4A 80W
SLP1006P2T R/TP 2P 1 SEMTECH
INTERNATIONAL AG
KJA-PH-4-0176 5P 2P ANGLE R/TP 3.5M BLACK
5P - KSD CO., LTD
GRM1555C1H6R8C_H 6.8pF 0.25PF 50V C0G -
55TO+125C 1005 R/TP 0.5+/-0.05 L:1.0+-0.05
W:0.5+-0.05 T:0.5+-0.05 MURATA
MANUFACTURING CO.,LTD.
MSM8210 Dual 1.2GHz A7, 1x300 LPDDR2,
HSPA(7.2/5.8),CDMA, TD-SCDMA,DOrA,DSDS,
qHD display@ 60fps, Adreno 302, 12x12mm NSP
R/TP 488P QUALCOMM INCORPORATED.
MCR006YZPJ222 2.2KOHM 5% 1/20W 0603 R/TP
- ROHM.
CL05A106MP5NUNC 10uF 20% 10V X5R -
55TO+85C 1005 R/TP 0.55T max. SAMSUNG
ELECTRO-MECHANICS CO., LTD.
MAMK2520T1R0M 1UH 20% - 2.7A 3.1 2.7
0.059OHM - - SHIELD 2.5X2.0X1.2MM - R/TP
TAIYO YUDEN CO.,LTD
BLM03AX241SN1D 240 ohm 0.6X0.3X0.33 25%
0.38 ohm 0.35A SMD R/TP 2P 0 MURATA
MANUFACTURING CO.,LTD.
1005GC2T27NJLF 27NH 5% - 200mA - - 0.9OHM
1.4GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
- 262 - Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes