LG -D175F Service Manual page 259

Level Location No.
Capacitor
6 C4118
Ceramic,Chip
6 D9200 Diode,TVS
Capacitor
6 C5124
Ceramic,Chip
6 U1500 IC Assembly
6 CN9600 Socket,Card
6 R9101 Resistor,Chip
C1111 Inductor
6
C1131 Multilayer,Chip
VA9500
6 Varistor
VA9501
Capacitor
6 C5104
Ceramic,Chip
D9201
6 D9601 Varistor
ZD9100
D5100
L1101
L5305
Inductor
6 L5403
Multilayer,Chip
L5404
L9910
L9911
Inductor
6 L1604
Multilayer,Chip
LGE Internal Use Only
12. EXPLODED VIEW & REPLACEMENT PART LIST
Description PartNumber
EAE63162401
EAH61872601
ECZH0000802
EAN62686601
EAG62830201
ERHZ0000222
ELCH0004713
SEVY0003601
ECCH0009105
SEVY0004401
ELCH0001430
ELCH0004705
Spec
GRM188R61E106M 10uF -20TO20% 25V X5R -
55TO+85C 1608 R/TP Max 1.0T L:1.6+-0.2 W:0.8+-
0.2 T:0.8+-0.2 MURATA MANUFACTURING
CO.,LTD.
PESD12VS1UA 12V 13.3V min. 19V 22.5A 360mW
SOD323 R/TP 2P 1 NXP Semiconductors
C1005C0G1H010CT 1pF 0.25PF 50V NP0 -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
WTR2605 2G/3G, WCDMA, GSM, EDGE, CDMA
and TDSCDMA Multi Mode QUALCOMM
INCORPORATED.
104031-0811 SD 8P ANGLE SMD R/TP
11.95x11.40x1.42t, Push-pull type MOLEX
MCR01MZP5F1503 150KOHM 1% 1/16W 1005
R/TP - ROHM.
1005GC2T6N8JLF 6.8NH 5% - 250mA 0.32OHM
3GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
ICVL0505101V150FR 5.6V 0% 100pF 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
C0603C0G1H820JT00NN 82pF 5% 50V NP0 -
55TO+125C 0603 R/TP - - TDK CORPORATION
ICVL0518400V500FR 18V 0% 40pF 1.0*0.5*0.55
NONE SMD R/TP INNOCHIPS TECHNOLOGY
LL1005-FHLR10J 100NH 5% - 150mA 2.2OHM
1.03GHZ 10 SHIELD NONE 1.0X0.5X0.5MM R/TP
TOKO, INC.
1005GC2T8N2JLF 8.2NH 5% - 250mA 0.37OHM
2.8GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
- 259 - Copyright © 2014 LG Electronics. Inc. All right reserved.
Remark
Only for training and service purposes