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•
Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the housing, an area that is not accessible for post-wash inspections. The solvent will also damage
the sticker and the ink-jet printed text.
•
Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators.
For best results, use a "no clean" soldering paste and eliminate the cleaning step after the soldering
process.
5.3.3
Other remarks
•
Only a single reflow soldering process is allowed for boards with a module populated on them.
•
Boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices may require wave soldering to solder the THT components. Only a single
wave soldering process is allowed for boards populated with the modules. The Miniature Wave
Selective Solder process is preferred over the traditional wave soldering process.
•
Hand soldering is not recommended.
•
Rework is not recommended.
•
Conformal coating may affect the performance of the module, so it is important to prevent the
liquid from flowing into the module. The RF shields do not provide protection for the module from
coating liquids with low viscosity, and so care is required in applying the coating. Conformal
coating of the module will void the warranty.
•
Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or other
forms of metal strips directly onto the EMI covers is made at the customer's own risk and will void
the module's warranty. The numerous ground pins are adequate to provide optimal immunity to
interferences.
•
The module contains components that are sensitive to ultrasonic waves. Use of any ultrasonic
processes such as cleaning, welding etc., may damage the module. Use of ultrasonic processes on
an end-product integrating this module will void the warranty.
UBX-20027617 - R02
C1-Public
NORA-B1 series - System integration manual
Handling and soldering
Page 37 of 58
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