Laird BT830-SA Hardware Integration Manual page 33

BT830 Hardware Integration Guide
Version 1.3
Laird surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately
it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during
reflow meet the requirements of the solder paste. Laird surface mount modules conform to J-STD-020D1 standards
for reflow temperatures.
Important: During reflow, modules should not be above 260° and not for more than 30 seconds.
Figure 0-23: Recommended Reflow Temperature
Temperatures should not exceed the minimums or maximums presented in
Table 18: Recommended Maximum and minimum temperatures
Specification
Temperature Inc./Dec. Rate (max)
Temperature Decrease rate (goal)
Soak Temp Increase rate (goal)
Flux Soak Period (Min)
Flux Soak Period (Max)
Flux Soak Temp (Min)
Flux Soak Temp (max)
Time Above Liquidous (max)
Time Above Liquidous (min)
Time In Target Reflow Range (goal)
Time At Absolute Peak (max)
Liquidous Temperature (SAC305)
Lower Target Reflow Temperature
Upper Target Reflow Temperature
Absolute Peak Temperature
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
Table
Value Unit
1~3 °C / Sec
2-4 °C / Sec
.5 - 1 °C / Sec
70 Sec
120 Sec
150 °C
190 °C
70 Sec
50 Sec
30 Sec
5 Sec
218 °C
240 °C
250 °C
260 °C
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