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Hewlett Packard Enterprise 3PAR StoreServ 8 0A Series Product End-Of-Life Disassembly Instructions
Hewlett Packard Enterprise 3PAR StoreServ 8 0A Series Product End-Of-Life Disassembly Instructions

Hewlett Packard Enterprise 3PAR StoreServ 8 0A Series Product End-Of-Life Disassembly Instructions

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Product End-of-Life Disassembly Instructions
Product Category: Storage Enclosures
Marketing Name / Model
[List multiple models if applicable.]
HPE 3PAR StoreServ 8xx0A
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries
Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
MF877-00
Template Revision A
Notes
With a surface greater than 10 sq cm
All types including standard alkaline and lithium
coin or button style batteries
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
PVC insulation
6 Heat sink clips; 11 connector housings; 7 misc
structural parts
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
HPE instructions for this template are available at
MF877-01
Quantity
of items
included
in product
24
4
0
0
0
0
18
4
46
0
0
0
Page 1

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Summary of Contents for Hewlett Packard Enterprise 3PAR StoreServ 8 0A Series

  • Page 1 Product End-of-Life Disassembly Instructions Product Category: Storage Enclosures Marketing Name / Model [List multiple models if applicable.] HPE 3PAR StoreServ 8xx0A Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU directive 2012/96/EC, Waste Electrical and Electronic Equipment (WEEE).
  • Page 2 Quantity of items Item Description Notes included in product Components, parts and materials containing radioactive substances 2.0 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
  • Page 3 Attachment 1 – removing midplane PCA from drive chassis. Attachment 2—removing battery pack from Power Cooling Module. Attachment 3—removing electrolytic caps from Power Cooling Module. Attachment 4—removing coin cell from Node PCA. Attachment 1 - Removing Midplane PCA from drive chassis MF877-00 Page 3 Template Revision A...
  • Page 4 Attachment 2 -Removing battery from Power Cooling Module Remove the battery pack PCA from the enclosure Carefully Remove the lithium Ion batteries avoid shorting terminals MF877-00 Page 4 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 5 Attachment 3 - Removing Electrolytic Capacitors from Power Cooling Module MF877-00 Page 5 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 6 Attachment 4 - Removing coin cell, capacitors and screws from the motherboard. MF877-00 Page 6 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 7 Chassis level Disassembly: MF877-00 Page 7 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 8 MF877-00 Page 8 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 9 MF877-00 Page 9 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 10 MF877-00 Page 10 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 11 MF877-00 Page 11 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 12 MF877-00 Page 12 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 13 MF877-00 Page 13 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 14 MF877-00 Page 14 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 15 MF877-00 Page 15 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 16 MF877-00 Page 16 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 17 MF877-00 Page 17 Template Revision A HPE instructions for this template are available at MF877-01...
  • Page 18 MF877-00 Page 18 Template Revision A HPE instructions for this template are available at MF877-01...