SIM Tech SimCom SIM5320JE-TE Hardware Design page 59

the application to the RF receiver in the receiver band. RF emissions interfere with audio input/output. It is
recommended to shield the sensitive components and trace with common ground and user can add beads
where necessary.
Normally SIM5320JE-TE is mounted on customer host board. Although some ESD components have been
added in SIM5320JE-TE, to prevent ESD, user should put some ESD components on customers' board.
The ESD components should be placed beside the connectors which human body might touch, such as
SIM card holder, audio jacks, switches, keys, etc. The following table is the SIM5320JE-TE ESD
measurement performance; the results are from SIMCom EVB test.
Table 45: The ESD performance measurement table (Temperature: 25 , Humidity:
Part
VBAT,GND
UART,USB
Antenna port
Other ports
SIM5320JE-TE_Hardware Design_V1.01
Contact discharge
±4KV
±2KV
±4KV
±2KV
59
Smart Machine Smart Decision
℃
45%)
Air discharge
±6KV
±6KV
±6KV
±2KV
2012-07-10