APPLICATION NOTE RAA604S00 R01AN4426EJ0100 Rev.1.00 Guidelines for two-layer board for RF part Dec 21, 2018 Introduction This document states guidelines to be observed when designing RF board with two-layer substrate. Target Device RAA604S00 Note: The contents of this document are provided as an example for reference and do not guarantee the signal quality in systems.
RAA604S00 Guidelines for two-layer board for RF part Overview This document uses the pin names of the RAA604S00. Table 1 briefly describes the pins used in the RAA604S00. Table 1 Description of the RAA604S00 Pins Pin Name Function Number STANDBY...
RAA604S00 Guidelines for two-layer board for RF part Oscillator Note the following points for design in relation to the oscillator. • Place the load capacitor close to the crystal resonator electrode. • Separate the signal lines for the crystal resonator’s pins 26 (XIN) and 27 (XOUT) from those for pin 22 (RFOUT) by at least 4.5 mm because a narrower separation may lead to an unacceptable level of intermodulation interference.
RAA604S00 Guidelines for two-layer board for RF part External Circuit for DC-DC Converter Note the following points for design in relation to the feedback loop of the DC-DC converter. • We recommend not placing signal lines in the vicinity of pins 29 (REGIN), 30 (VSSDDC), and 31 (DDCOUT).
RAA604S00 Guidelines for two-layer board for RF part RF Signal Lines Note the following points for design in relation to the circuit in the vicinity of the RF signal lines. • Design the RF signal lines as coplanar lines and also as having an impedance of 50 Ω.
• Keep the digital signal lines as short as possible to reduce digital noise. We recommend inserting series resistors as required. In that case must be placed R16, R18, and R19 on the MCU side and R17 and R20 on the RAA604S00 side.
RAA604S00 Guidelines for two-layer board for RF part Power Supply Note the following points for design in relation to the power supply circuit. • Place the bypass capacitors on the surface layer of the board and as close as possible to the pins.
RAA604S00 Guidelines for two-layer board for RF part Ground Pattern Note the following points for design in relation to the ground pattern. • Place as many via holes as possible to create short circuits with ground patterns in other layers. This helps keep the impedance low.
RAA604S00 Guidelines for two-layer board for RF part Circuit Diagram for Reference Figure 9 and Figure 10 are circuit diagram for reference. TOOL0 RESETB PAD12 PAD11 P140 P137 P147 P146 P120 P122 P121 X'tal X'tal PAD9 PAD10 P120 P147 DieGND...
RAA604S00 Guidelines for two-layer board for RF part List of Parts for Reference Table 2 lists parts for reference. Table 2 List of Parts for Reference (1/2) Parts ID Description Parts number Remarks We recommend a tolerance of ± 10%.
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Crystal Subsystem Clock for MCU resonator Not mounted Example: SSP-T7-FL from Seiko Instruments 32.768 kHz R5F104GLANA RL78/G14 from Renesas Electronics with RF switch, * for ARIB, * for ETSI, * for FCC R01AN4426EJ0100 Rev.1.00 Page 11 of 13 Dec 21, 2018...
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RAA604S00 Guidelines for two-layer board for RF part Main parts list Table 3 lists constants for main parts. It is necessary to mount parts according to the radio law of the region to be used. Table 3 Parts constants corresponding to each radio law...
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RAA604S00 Guidelines for two-layer board for RF part Website and Support Renesas Electronics Website http://www.renesas.com/ Inquiries http://www.renesas.com/contact/ All trademarks and registered trademarks are the property of their respective owners. R01AN4426EJ0100 Rev.1.00 Page 13 of 13 Dec 21, 2018...
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Revision History Description Rev. Date Page Summary 1.00 Dec 21, 2018 First edition issued...
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General Precautions in the Handling of Microprocessing Unit and Microcontroller Unit Products The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
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