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Item Description
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Torque Driver (Standard)
Torque Bit
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew and remove - SCREW-MACHINE ASSEMBLY M5 X 0.8 10M ROHS at 2 locations
2. Unscrew and remove - ASSY, BULKHEAD BLANK FP
3. Unscrew and remove - ASSY, BLANK STACKING LAVA
4. Press handle and remove - PS BLANK FILLER
5. Press handle and remove PWR SUPPLY 680 W
6. Unscrew and remove - SCREW-THD-RLG M3 X 0.5 5MM-LG BLACK ROHS at 17 Locations and ASSY, CHASSIS
COVER LAVA2 AQM
7. Unplug Connector of FAN ASSEMBLY LAVA at 3 locations from PCA and remove the FAN ASSEMBLY LAVA
8. Unplug and remove - 1MM FFC CABLE,76MM LONG
9. Unscrew and remove - SCREW T10 M3X6 at 2 locations.
10. Remove PCA, LAVA LED BOARD
11. Remove PUSHBUTTON, SMT, MODE SWITCH
12. Unscrew and remove SCREW-TAPPING M3 X 0.5 8MM-LG ROHS at 11 Locations and PCA, LAVA2 24SR WITH
POE+ & MECH
13. Remove INSULATOR LAVA
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
MF877-00
Template Revision B, 18-Nov-2016
Notes
HPE instructions for this template are available at
Tool Size (if
applicable)
T10
T10-70 mm
MF877-01
Quantity
of items
included
in product
Page 2
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