Sony HT-ST9 Service Manual page 86

HT-ST9
Ver. 1.1
IO KEY MB1406
Ref. No. Part No. Description
R1703 1-218-957-11 METAL CHIP
R1704 1-218-941-81 METAL CHIP
R1707 1-218-967-11 METAL CHIP
R1708 1-218-967-11 METAL CHIP
R1709 1-218-941-81 METAL CHIP
R1710 1-218-965-11 METAL CHIP
R1711 1-218-935-11 METAL CHIP
R1716 1-218-929-11 METAL CHIP
R1719 1-218-929-11 METAL CHIP
R1720 1-218-968-11 METAL CHIP
R1721 1-218-968-11 METAL CHIP
R1722 1-218-935-11 METAL CHIP
*************************************************************
A-2058-288-A KEY BOARD, COMPLETE
*******************
When the KEY board is defective, replace the complete mounted board.
*************************************************************
A-2071-285-A MB1406 BOARD, COMPLETE (SV) (US, CND)
9
A-2071-287-A MB1406 BOARD, COMPLETE (SV) (AEP)
9
A-2071-288-A MB1406 BOARD, COMPLETE (SV) (UK)
9
A-2071-289-A MB1406 BOARD, COMPLETE (SV) (RU)
9
A-2071-290-A MB1406 BOARD, COMPLETE (SV) (SP)
9
A-2071-291-A MB1406 BOARD, COMPLETE (SV) (AUS)
9
A-2071-293-A MB1406 BOARD, COMPLETE (SV) (CH)
9
A-2071-294-A MB1406 BOARD, COMPLETE (SV) (TW)
9
A-2071-298-A MB1406 BOARD, COMPLETE (SV) (LA)
9
**********************
When the MB1406 board is defective, replace the complete mounted board.
*************************************************************
A-2054-811-A POWER BOARD, COMPLETE
A-2059-212-A POWER BOARD, COMPLETE (US, CND, TW)
A-2075-345-A POWER BOARD, COMPLETE (LA)
**********************
7-685-646-71 SCREW +BVTP 3X8 TYPE2 IT-3
< CAPACITOR >
0 C902 1-112-871-51 CERAMIC
0 C903 1-112-871-51 CERAMIC
0 C905 1-114-594-21 FILM
0 C907 1-116-397-21 FILM
0 C914 1-118-996-11 ELECT
0 C915 1-118-715-11 ELECT (BLOCK) 100uF
0 C930 1-118-361-11 CERAMIC CHIP 0.1uF
0 C931 1-164-217-91 CERAMIC CHIP 150PF
Note 1: When the complete MB1406 board is replaced, refer to
"NOTE OF REPLACING THE COMPLETE MB1406
BOARD OR CARD WLAN/BT COMBO" on page 6.
86
POWER
Remark
2.2K 5% 1/16W
100 5% 1/16W
15K 5% 1/16W
15K 5% 1/16W
100 5% 1/16W
10K 5% 1/16W
33 5% 1/16W
10 5% 1/16W
10 5% 1/16W
18K 5% 1/16W
18K 5% 1/16W
33 5% 1/16W
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(See Note 1)
(AEP, RU, UK, AUS, CH, SP)
0.0022uF 20% 250V
(Except US, CND, TW) (See Note 2)
0.0022uF 20% 250V
(Except US, CND, TW) (See Note 2)
0.22uF 10% 310V
(See Note 2)
0.33uF 10% 310V
(Except US, CND, TW) (See Note 2)
390uF 20% 200V
(US, CND, TW) (See Note 2)
20 % 450V
(AEP, RU, UK, AUS, CH, SP)
10% 50V
5% 50V
(US, CND, TW)
Ref. No. Part No.
0 C931 1-164-218-91
0 C932 1-162-968-91
0 C933 1-116-717-11
0 C934 1-116-729-11
0 C935 1-117-824-11
0 C936 1-118-361-11
0 C937 1-116-874-11
0 C938 1-112-841-11
0 C939 1-116-034-92
0 C940 1-112-869-51
0 C941 1-112-235-21
C951 1-116-739-11
C952 1-118-291-11
C967 1-114-994-11
C968 1-118-361-11
C970 1-112-244-11
C971 1-118-345-11
C976 1-112-245-21
C977 1-112-245-21
C980 1-112-245-21
0 C988 1-114-721-21
0 C989 1-112-870-51
0 C990 1-112-870-51
C992 1-118-373-11
0 C993 1-116-772-11
C994 1-112-241-11
0* CN901 1-793-660-11
0 D901 8-719-077-77
0 D930 6-503-021-01
0 D931 8-719-083-71
0 D932 6-502-975-01
0 D934 6-502-961-01
0 D936 6-501-119-01
0 D937 6-501-119-01
0 D938 6-503-731-01
0 D939 6-503-037-01
0 D941 8-719-083-71
0 D942 6-503-775-01
D951 6-502-961-01
D952 6-503-037-01
D965 6-504-084-01
D967 6-503-978-01
0 D972 6-502-264-01
D973 8-719-083-71
0 D974 6-503-036-01
0 D974 6-503-037-01
0 D975 6-502-961-01
Note 2: When C902, C903, C905, C907, C914, C939, C967, C970, C988, C989,
C990, C994 and D901 on the POWER board are replaced, refer to
"BOND FIXATION OF ELECTRIC PARTS" on page 9.
Description
CERAMIC CHIP 180PF 5%
(Except US, CND, TW)
CERAMIC CHIP 0.0047uF 10%
CERAMIC CHIP 10uF 20%
CERAMIC CHIP 2.2uF 20%
FILM 2200PF 3%
(US, CND, TW)
CERAMIC CHIP 0.1uF 10%
CERAMIC CHIP 10uF 10%
FILM 820PF 3%
(Except US, CND, TW)
FILM 0.0033uF 5%
CERAMIC 470PF 10%
(US, CND, TW)
ELECT 330uF 20%
CERAMIC CHIP 0.47uF 10%
CERAMIC CHIP 100PF 5%
ELECT 2200uF 20%
CERAMIC CHIP 0.1uF 10%
ELECT 2200uF 20%
CERAMIC CHIP 0.01uF 10%
ELECT 47uF 20%
ELECT 47uF 20%
ELECT 47uF 20%
FILM 0.1uF 10%
(US, CND, TW) (See Note 2)
CERAMIC 0.001uF 20%
(US, CND, TW) (See Note 2)
CERAMIC 0.001uF 20%
(US, CND, TW) (See Note 2)
CERAMIC CHIP 0.01uF 10%
ELECT (BLOCK) 180uF 20%
ELECT 1000uF 20%
< CONNECTOR >
PIN, CONNECTOR (PC BOARD) 3P
< DIODE >
DIODE D3SB60F3 (See Note 2)
DIODE DZ2J10000L
DIODE UDZSUSTE-1730B
DIODE DZ2J15000L
DIODE DA2J10100L
DIODE RR264M-400
DIODE RR264M-400
DIODE SARS10
DIODE DZ2J24000L
DIODE UDZSUSTE-1730B
DIODE CRH02 (T5R, SONY, XM)
DIODE DA2J10100L
DIODE DZ2J24000L
DIODE LQA20T200C
DIODE RB068L100TE25
DIODE KDZTR18B
DIODE UDZSUSTE-1730B
DIODE DZ2J220M0L (US, CND, TW)
DIODE DZ2J24000L (Except US, CND, TW)
DIODE DA2J10100L
Remark
50V
50V
10V
10V
1.5KV
50V
35V
1.5KV
400V
(See Note 2)
250V
25V
50V
50V
35V
(See Note 2)
50V
25V
(See Note 2)
25V
35V
35V
35V
310V
250V
250V
50V
450V (LA)
25V
(See Note 2)