Sony HT-ST9 Service Manual page 61

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS.
(In addition to this, the necessary note is printed in each block.)
For Printed Wiring Boards.
Note:
• X : Parts extracted from the component side.
• Y : Parts extracted from the conductor side.
• : Internal component.
f
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side: Parts on the pattern face side seen
(Conductor Side) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Component Side) the parts face are indicated.
Caution:
Pattern face side: Parts on the pattern face side seen
(SIDE B) from the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(SIDE A) the parts face are indicated.
• MB1406 board is multi-layer printed board. However, the
patterns of intermediate layers have not been included in
diagrams.
• Indication of transistor.
C
Q
These are omitted.
B E
• Lead layouts
Lead layout of conventional IC CSP (Chip Size Package)
Note 1: When the MB1406 board is defective, replace the
complete mounted board.
Note 2: When the complete MB1406 board is replaced, re-
fer to "NOTE OF REPLACING THE COMPLETE
MB1406 BOARD OR CARD WLAN/BT COMBO"
on page 6.
Note 3: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC7004, IC7005,
IC7007 AND IC7008 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD" on page 6.
HT-ST9
For Schematic Diagrams.
Note:
• All capacitors are in μF unless otherwise noted. (p: pF) 50
WV or less are not indicated except for electrolytics and
tantalums.
• All resistors are in Ω and 1/4 W or less unless otherwise
specifi ed.
• : Internal component.
f
• 2 : Nonfl ammable resistor.
• 5 : Fusible resistor.
• C : Panel designation.
Note: The components identifi ed by mark 0 or
dotted line with mark 0 are critical for safety.
Replace only with part number specifi ed.
Note: Les composants identifi és par une marque
0 sont critiques pour la sécurité.
Ne les remplacer que par une piéce portant
le numéro spécifi é.
• A : B+ Line.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : POWER ON
• Voltages are taken with VOM (Input impedance 10 M).
Voltage variations may be noted due to normal production
tolerances.
• Waveforms are taken with a oscilloscope.
surface Voltage variations may be noted due to normal production
tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F : AUDIO
L : USB
: LAN
d
: WIRELESS LAN/Bluetooth
G
E : VIDEO
Note 1: When the MB1406 board is defective, replace the
complete mounted board.
Note 2: When the complete MB1406 board is replaced, re-
fer to "NOTE OF REPLACING THE COMPLETE
MB1406 BOARD OR CARD WLAN/BT COMBO"
on page 6.
Note 3: When the complete AMP board is replaced, refer to
"NOTE OF REPLACING THE IC7004, IC7005,
IC7007 AND IC7008 ON THE AMP BOARD AND
THE COMPLETE AMP BOARD" on page 6.
• Circuit Boards Location
REPEATER_REP2
board
POWER board
CARD WLAN/BT COMBO
(WIFI1)
61 61
AMP board
IO board
KEY board
REPEATER_REP1
board
MB1406 board
DISPLAY board
NFC module (RC-S730)
(NFC1)
RF modulator
(RF1)
HT-ST9
Ver. 1.1
WS board
USB board