Mid-Bus Probe Retention - Teledyne Lecroy PCI Express 3.0 Mid-Bus Probe Installation And Usage Manual

Mid‐bus Probe Retention
PCIe Gen 3 Half Size Keepout Volume
Note: All
dimensions in
inches
Figure 3.4: PCIe Gen 3 Half Width Probe Keepout Volume
PCB Layout of Full Size PCIe Gen 3 Mid-bus Footprint
Figure 3.5: Full Size PCIe Gen 3 PCB Footprint
PCB Layout of Half Size PCIe Gen 3 Mid-bus Footprint
Figure 3.6: Half Size PCIe Gen 3 PCB Footprint
3.2

Mid-bus Probe Retention

To prepare a circuit board for PCI Express mid‐bus probing, the mid‐bus footprint has to
be laid out onto the target system board and a probe connector has to be attached to the
board. Attachment of the probe connector is simple and quick. There are two through‐
hole screws and one protrusion key underneath the probe connector. Align the key of the
probe connector with the keying/alignment hole in the mid‐bus footprint on the target
system board, and connect the small screws (supplied) through the PCB and into the
threaded holes on the underside of the Mid‐bus connector module, and tighten the
screws to ensure good contact between the contacts of the connector and the pads on
PCIe 3.0 Mid‐Bus Probe Installation and Usage Guide
Teledyne LeCroy
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