Chapter 3: Mechanical Design; Probe Footprints - Teledyne Lecroy PCI Express 3.0 Mid-Bus Probe Installation And Usage Manual

Mechanical Design
This section describes footprint dimensions, keepout volumes, and probe pin
assignments.
3.1

Probe Footprints

The Mid‐bus Probe is fully compatible with the standardized mid‐bus footprint
recommended by the Intel guideline, as shown in the following figures.
Full-Size Probe Footprint
Figure 3.1: PCIe Gen 3 Footprint
Chapter 3
PCIe 3.0 Mid‐Bus Probe Installation and Usage Guide 9