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HUAWEI ME906s LTE M.2 Module
Hardware Guide
Acronym or Abbreviation
GSM
HBM
HSIC
HSDPA
HSPA+
HSUPA
IPC
ISO
I2S
LCD
LCP
LDO
LED
LTE
MCP
MIPI
NGFF
NTC
PA
PBCCH
PCB
PDU
PMU
RF
RoHS
RSE
RTC
SIMO
TTL
TVS
Issue 05 (2019-03-25)
Expansion
Global System for Mobile communication
Human Body Model
High Speed Inter-Chip Interface
High-Speed Downlink Packet Access
Enhanced High Speed Packet Access
High Speed Up-link Packet Access
Inter Processor Communications
International Standards Organization
I2C Sound
Liquid Crystal Display
Liquid Crystal Polyester
Low-Dropout
Light-Emitting Diode
Long Term Evolution
Multi-chip Package
Mobile Industry Processor Interface
Next Generation Form Factor
Negative Temperature Coefficient
Power Amplifier
Packet Broadcast Control Channel
Printed Circuit Board
Protocol Data Unit
Power Management Unit
Radio Frequency
Restriction of the Use of Certain Hazardous
Substances
Radiated Spurious Emission
Real-time Clock
Single Input Multiple Output
Transistor-transistor Logic
Transient Voltage Suppressor
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
Appendix B Acronyms and Abbreviations
77
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