Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E103-W01 User Manual

Chengdu Ebyte Electronic Technology Co., Ltd.

11 Production guidance

11.1 Reflow soldering temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

11.2 Reflow soldering curve

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Feature
Solder paste
Min preheating temp.
Max preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp
Time below liquid phase
line
Peak temp
Average ramp-down rate
Time to peak
temperature for 25℃
E103-W01 User Manual
Sn-Pb Assembly
Sn63/Pb37
100℃
150℃
60-120 sec
3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max
6 minutes max
Pb-Free Assembly
Sn96.5/Ag3/Cu0.5
150℃
200℃
60-120 sec
3℃/second max
217℃
30-90 sec
230-250℃
6℃/second max
8 minutes max
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