Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E31-400M17S Manual

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7 Soldering Guidance

7.1 Reflow Soldering Temperature

Profile Feature
Solder Paste
Preheat Temperature min (Tsmin)
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time(tL)Maintained Above(TL)
Peak temperature(Tp)
Average ramp-down rate(Tp to Tsmax)
Time 25℃ to peak temperature

7.2 Reflow soldering curve

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Curve characteristics
Solder paste
Min preheating temp.
Mx preheating temp.
Preheating time
Average ramp-up rate
Liquid phase temp.
Time below liquid phase
line
Peak temp.
Average ramp-down rate
Time to peak temperature
for 25℃
E31-400M17S User Manual
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
6 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
8 minutes max
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