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Related Manuals for Multitech MultiConnect xDot MTXDOT-EU1 Series
Summary of Contents for Multitech MultiConnect xDot MTXDOT-EU1 Series
- Page 1 ® MultiConnect xDot MTXDOT Developer Guide...
- Page 2 Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage.
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Page 3: Table Of Contents
CONTENTS Contents Chapter 1 – Product Overview ..........................7 Overview ..................................7 What's New in Firmware Version 3.1 ........................... 7 xDot Bootloader................................7 Power Optimization ..............................7 Other Enhancements ..............................7 Documentation Overview ............................. 7 Related Documentation .............................. 8 mbed Documentation ..............................8 Programming the xDot Microcontroller ........................ - Page 4 CONTENTS Crystals/Oscillator ..............................24 Sleep Wake and Deep Sleep Wake Pins ........................25 InterruptIn Limitations.............................. 25 xDot Pinout Design Notes ............................26 Serial Pinout Notes..............................26 Serial Settings................................26 LoRa .................................... 26 Throughput Rates..............................26 Range ..................................26 Resetting the xDot ..............................28 Chapter 5 –...
- Page 5 CONTENTS User Responsibility..............................42 Chapter 7 – Regulatory Information........................43 EMC, Safety, and Radio Equipment Directive (RED) Compliance ................43 47 CFR Part 15 Regulation Class B Devices ......................... 43 FCC Interference Notice ............................. 43 FCC Notice ................................... 43 Industry Canada Class B Notice........................... 44 Chapter 8 –...
- Page 6 CONTENTS In-System Programming of xDot..........................62 Schematic Example ..............................63 Recommended Programming Hardware for Production..................63 JTAG/SWD Connector .............................. 64 Chapter 14 – Appendix A Release Note Archive ..................... 65 What's New in Firmware Version 3.0 ......................... 65 LoRaWAN 1.0.2 Support ............................65 Listen Before Talk ..............................
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Page 7: Chapter 1 - Product Overview
PRODUCT OVERVIEW Chapter 1 – Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWAN , low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments using the unlicensed ISM bands in North America, Europe and worldwide. -
Page 8: Related Documentation
USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries. -
Page 9: Xdot Platform
EUI and Networking xDots have an Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI: AT+DI=<8-BYTE-HEX-MSB> AT+DI=001122AABBCCDDEE For information on setting up xDots as part of a LoRa network, go to www.multitech.net. ® MultiConnect xDot MTXDOT Developer Guide... -
Page 10: Product Build Options
PRODUCT OVERVIEW Product Build Options Product Description Package Quantity North America MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1, 100, or 1000 MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 1, 100, or 1000 EMEA MTXDOT-EU1-IN1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100 MTXDOT-EU1-IN1-A01 868 MHz LoRa Module TRC (EU) -
Page 11: Chapter 2 - Getting Started
GETTING STARTED Chapter 2 – Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide. -
Page 12: Mac
GETTING STARTED AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to: https://developer.mbed.org/handbook/Windows-serial-configuration On Mac systems, COM ports appear in the Device Manager as: /dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port. - Page 13 GETTING STARTED For the application, create a file with the following content. Name it mbed_app.json and place it in the root directory. "target_overrides": { "XDOT_L151CC": { "target.bootloader_img": "bootloader_location/bootloader.bin" ® MultiConnect xDot MTXDOT Developer Guide...
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Page 14: Chapter 3 - Mechanical Drawings With Pinouts
MECHANICAL DRAWINGS WITH PINOUTS Chapter 3 – Mechanical Drawings with Pinouts xDot ® MultiConnect xDot MTXDOT Developer Guide... - Page 15 MECHANICAL DRAWINGS WITH PINOUTS Note: The xDot development board uses a land pattern that matches the xDot land pattern in the previous image. All pads are 0.028 inches square except the large one, which is 0.098 inches x 0.028 inches. ®...
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Page 16: Chapter 4 - Specifications And Pin Information
SPECIFICATIONS AND PIN INFORMATION Chapter 4 – Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility LoRaWAN 1.0 specifications Interfaces Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs Wake pin Reset pin Full UART... - Page 17 SPECIFICATIONS AND PIN INFORMATION Category Description Environment Operating -40° C to +85° C Temperature Storage -40° C to +85° C Temperature Humidity 20%-90% RH, non-condensing Power Requirements Operating Voltage 2.4 to 3.57 V Certifications and Compliance EMC and Radio EN 300 220-2 V2.4.1:2012 EN 300 220-2 V2.4.1:2012 Compliance EN 301 489-03 V1.6.1:2013...
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Page 18: Mapping Data Rate To Spreading Factor/Bandwidth
SPECIFICATIONS AND PIN INFORMATION Category Description Receive Sensitivity Spreading Factor North America, Asia, Australia Typical EMEA Typical Sensitivity Sensitivity -111 dBm -121 dBm -116 dBm -124 dBm -119 dBm -127 dBm -122 dBm -130 dBm -125 dBm -133 dBm -127 dBm -135 dBm -129 dBm -137 dBm... -
Page 19: Lora Transmission Output Power
SPECIFICATIONS AND PIN INFORMATION LoRa Transmission Output Power 868 Models Max output 25 dBm Power Frequency On Power-up (dBm) 18 Hours After Bandwidth Power-up (dBm) 869.525 MHz 24.18 125 kHz 869.525 MHz 24.18 24.83 250 kHz 915 Models Max output 27 dBm Power Frequency On Power-up (dBm) 18 Hours After... -
Page 20: Battery Draw Down
SPECIFICATIONS AND PIN INFORMATION Battery Draw Down xDot battery life depends on many variables, including transmit power, data rate, sleep usage, and duty cycle. The following figure represents the current consumption in one possible application. Use the current consumption values from the following Electrical Characteristics table when calculating average power consumption. -
Page 21: Measuring The Power Draw
SPECIFICATIONS AND PIN INFORMATION Signal Description Conditions Typical Units Idle mode (no TX, no 11.1 RX), processor active TX, TXP=2 TX, TXP=11 62.5 TX, TXP=20 Maximum supply current. Transmitting at TXP=20, all peripherals active, no load on IO pins. VDD = 3.3V. -
Page 22: Pin Information
SPECIFICATIONS AND PIN INFORMATION Pin Information Pin Information Note: Using the mbed platform expands your pin functionality options. ® MultiConnect xDot MTXDOT Developer Guide... - Page 23 SPECIFICATIONS AND PIN INFORMATION Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) The xDot is 0.045 x 0.045, board is 0.93 x 0.93 xDot Pin STM32L151CCU6 (Where SW Name Notes applicable) PB12 SPI_NSS PB13 SPI_SCK...
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Page 24: Pull-Up/Down
SPECIFICATIONS AND PIN INFORMATION Pull-Up/Down xDot Pin Pin Name SW Name PU/PD NRST 10k PU PA15 LORA_NSS 100k PU BOOT0 10k PD LORA_SCK 100k PD LORA_MOSI 100k PD LoRa Function LORA_DIO0 LORA_DIO1 LORA_DIO2 LORA_DIO3 LORA_DIO4 LORA_MISO LORA_MOSI PA15 LORA_NSS LORA_RESET LORA_SCK Secure Element Function... -
Page 25: Sleep Wake And Deep Sleep Wake Pins
SPECIFICATIONS AND PIN INFORMATION Sleep Wake and Deep Sleep Wake Pins Description Sleep Wake UART1_RX GPIO0 GPIO1 GPIO2 GPIO3 Wake Deep Sleep Wake Wake InterruptIn Limitations Due to the processor's architecture, only one pin of the same number (e.g. PA_1 & PB_1) may be configured as an InterruptIn. -
Page 26: Xdot Pinout Design Notes
SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. All pins that go to connectors are directly connected to the processor. Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application: Serial: Available out of the box. - Page 27 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models Frequency TX Power TX Antenna Gain RX Sensitivity -120 -120...
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Page 28: Resetting The Xdot
SPECIFICATIONS AND PIN INFORMATION Resetting the xDot To reset the xDot Drive the RESET signal low for at least T NRESET Select either: Allow RESET to float. The internal pull-up resistor pulls it up. Drive the RESET line high. The processor starts executing code after the RESET line is high. ®... -
Page 29: Chapter 5 - Antennas
ANTENNAS Chapter 5 – Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised. -
Page 30: Pulse Electronics Antenna
ANTENNAS Pulse Electronics Antenna Manufacturer: Pulse Electronics Description: 868-928 MHz RP-SMA Antenna, 8" Model Number: W1063 MultiTech Part Number: 45009830L MultiTech ordering information: Ordering Part Number Quantity AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA Antenna Specifications Category Description Frequency Range 868-928 MHz Impedance 50 Ohms VSWR <... -
Page 31: Rsma-To-U.fl Coaxial Cables
ANTENNAS Category Description Polarization Vertical RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Coaxial Cable Attenuation <1.0db Connector Impedance 50 ohm Maximum Cable Length 16" (40 cm) Ordering Information Part Number Description... -
Page 32: Ethertronics Chip Antenna
ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer: Ethertronics Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number: M620720 Datasheet: https://www.ethertronics.com/wp-content/uploads/2016/11/M620720-ISM-868- 915MHz-Ethertronics-Savvi-Ceramic-antenna-datasheet-20161020.pdf Antenna Specifications Category Description Electrical Specifications Frequency Range 868-870 MHz, 902-928 MHz Peak Gain 2.56 dBi VSWR... -
Page 33: Stackup Table
ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space. ® MultiConnect xDot MTXDOT Developer Guide... - Page 34 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space. ® MultiConnect xDot MTXDOT Developer Guide...
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Page 35: Chip Antenna Design Guidelines
ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following: The antenna's long side must be along the edge of the ground plane. Remove the ground plane from all layers below the antenna. The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components. -
Page 36: Antenna Pad Layout
ANTENNAS Antenna Pad Layout PCB Layout ® MultiConnect xDot MTXDOT Developer Guide... -
Page 37: Antenna Matching Network
ANTENNAS Antenna Matching Network The following images come from the xDot Developer Board schematics and show component populations for the antenna tuning circuit. The values you use depend on which frequency band you are using, 898 MHz or 915 MHz ®... -
Page 38: Oem Integration
ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below. -
Page 39: Host Labeling
ANTENNAS Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Host Labeling The following statements are required to be on the host label: This device contains FCC ID: AU792U13A16858 This device contains equipment certified under IC: 125A-0055 For labeling examples, see Cellular Approvals and Labeling Requirements. -
Page 40: Chapter 6 - Safety Information
SAFETY INFORMATION Chapter 6 – Safety Information Handling Precautions To avoid damage due to the accumulation of static charge, use proper precautions when handling any cellular device. Although input protection circuitry has been incorporated into the devices to minimize the effect of static build-up, use proper precautions to avoid exposure to electronic discharge during handling and mounting the device. -
Page 41: Interference With Pacemakers And Other Medical Devices
SAFETY INFORMATION Éteignez votre appareil sans fil dans les hôpitaux ou dans toutes les zones où des appareils médicaux sont susceptibles d'être utilisés. Interference with Pacemakers and Other Medical Devices Potential interference Radio frequency energy (RF) from cellular devices can interact with some electronic devices. This is electromagnetic interference (EMI). -
Page 42: User Responsibility
Do not place the device alongside computer discs, credit or travel cards, or other magnetic media. The information contained on discs or cards may be affected by the device. Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with MultiTech's accessory specifications may invalidate the warranty. -
Page 43: Chapter 7 - Regulatory Information
This device is open development based product that contains a sub GHz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 &... -
Page 44: Industry Canada Class B Notice
US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS 247:2015) MultiTech provides software code meant to operate the radio to a level that maintains compliance with the operating modes under which these radio devices were certified. To ensure this level of compliance, the software code is provided in binary form only. -
Page 45: Chapter 8 - Environmental Notices
Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements. -
Page 46: Restriction Of The Use Of Hazardous Substances (Rohs)
2011/65/EU of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS). These MultiTech products do not contain the following banned chemicals Lead, [Pb] < 1000 PPM Mercury, [Hg] <... -
Page 47: Information On Hs/Ts Substances According To Chinese Standards
ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc. -
Page 48: Information On Hs/Ts Substances According To Chinese Standards (In Chinese)
ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依 依 照 照 中 中 国 国 标 标 准 准 的 的 有 有 毒 毒 有 有 害 害 物 物 质 质 信 信 息 息 根据中华人民共和国信息产业部... -
Page 49: Chapter 9 - Labels
(2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number. Example xDot Device Label Example Developer Board Device Label ®... -
Page 50: Chapter 10 - Developer Kit Overview
DEVELOPER KIT OVERVIEW Chapter 10 – Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following: Developer Board... -
Page 51: Xdot Developer Kit Mechanical Drawings
DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. ® MultiConnect xDot MTXDOT Developer Guide... -
Page 52: Micro Developer Board Leds
DEVELOPER KIT OVERVIEW Micro Developer Board LEDs Description LED1 User-definable LED. LED3/SDA Programming Status. LED2/PWR Power, blue light when the board has power. LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram). -
Page 53: Chapter 11 - Developer Board Schematics
DEVELOPER BOARD SCHEMATICS Chapter 11 – Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams ® MultiConnect xDot MTXDOT Developer Guide... - Page 54 DEVELOPER BOARD SCHEMATICS Bottom ® MultiConnect xDot MTXDOT Developer Guide...
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Page 55: Schematics
DEVELOPER BOARD SCHEMATICS Schematics ® MultiConnect xDot MTXDOT Developer Guide... - Page 56 DEVELOPER BOARD SCHEMATICS ® MultiConnect xDot MTXDOT Developer Guide...
- Page 57 DEVELOPER BOARD SCHEMATICS ® MultiConnect xDot MTXDOT Developer Guide...
- Page 58 DEVELOPER BOARD SCHEMATICS ® MultiConnect xDot MTXDOT Developer Guide...
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Page 59: Chapter 12 - Design Considerations
DESIGN CONSIDERATIONS Chapter 12 – Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing. -
Page 60: Electrostatic Discharge Control
Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers. -
Page 61: Chapter 13 - Mounting Xdots And Programming External Targets
MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 13 – Mounting xDots and Programming External Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Diagram. Solder Profile Solder Paste: AIM M8 Lead-Free Note: Calculate slope over 120 seconds Name Low Limit High Limit... -
Page 62: Setpoints (Celsius)
MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Bottom Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150- Peak Temp Total Time /218C 170C Position Slope Slope Time Temp Time <TC2> 1.38 -0.63 28.82 240.22 -30% 43.61 -55%... -
Page 63: Schematic Example
Recommended Programming Hardware for Production Note: MultiTech does not recommend using the MTMDK-XDOT developer board for production programming. It doesn't have ESD protection, isn't enclosed, and wasn’t tested to be a robust solution for production. MultiTech recommends using the following programming hardware for production: Segger J-Link programmer - SEG-JLINK https://www.segger.com/products/debug-probes/j-link... -
Page 64: Jtag/Swd Connector
MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS JTAG/SWD Connector The developer board uses an unshrouded 9-pin header. Suitable connector headers include: Harwin: M50-3500542 Mouser: 855-M50-3500542 Samtec shrouded header: FTSH-105-01-F-D-K The Samtec FTSH-105 header dimensions are 0.25"x 0.188" (6.35mm x 4.78mm). Ensure that you connect your cable correctly, typically by matching the "1" marked on the board to the cable's red stripe. -
Page 65: Chapter 14 - Appendix A Release Note Archive
APPENDIX A RELEASE NOTE ARCHIVE Chapter 14 – Appendix A Release Note Archive What's New in Firmware Version 3.0 The new release includes the following changes: LoRaWAN 1.0.2 Support Listen Before Talk Separate Channel Plans For more information on using these features, visit https://developer.mbed.org/platforms/MTS-xDot-L151CC/. LoRaWAN 1.0.2 Support Adds AS923, extending support to Brunei, Cambodia, Hong Kong, Indonesia, Japan, Laos, New Zealand, Singapore, South Korea, Taiwan, Thailand, and Vietnam. -
Page 66: Index
INDEX Index schematics Developer Board ...........53 electrical characteristics..........20 electromagnetic interference ........59 electrostatic discharge ..........60 EMI ................59 antenna ..............29 30 ESD ................60 developer board ............32 EUI ...................9 antenna design guidelines ..........35 external targets.............62 assembly diagrams Developer Board ............53 AT command port ................11 grant notes...............38 FCC Notice Class B ..............43... - Page 67 INDEX host ................38 receive sensitivity............16 labels ................49 related products..............7 Linux ................11 reset ................28 LoRa ribbon cable ..............62 range ................26 RoHS................46 RSMA-to-UFL cable ............31 Mac ................11 maintenance ..............41 safety mbed ................8 RF interference ............40 mechanical drawings.............14 safety standards............59 Micro Developer Board..........51 serial settings ..............26 MTAC-LORA..............7 solder profile ..............61...
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