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Multitech MultiConnect xDot MTXDOT-NA1 Series Developer's Manual

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Summary of Contents for Multitech MultiConnect xDot MTXDOT-NA1 Series

  • Page 1 ® xDot Developer Guide...
  • Page 2 Legal Notices The MultiTech products are not designed, manufactured or intended for use, and should not be used, or sold or re-sold for use, in connection with applications requiring fail-safe performance or in applications where the failure of the products would reasonably be expected to result in personal injury or death, significant property damage, or serious physical or environmental damage.
  • Page 3 CONTENTS Contents Chapter 1 – Product Overview ..........................7 Overview ..................................7 What's New in Firmware Version 4.1 ........................... 7 LoRaWAN 1.0.4 Support and Regional Parameters RP2 1.0.3.................. 7 Changes to Wake Pin..............................7 Improved Boot Time from Sleep Mode........................7 AT Command Additions and Modifications ........................
  • Page 4 CONTENTS Indian Models (MTXDOT-EU1-IN1) ........................... 25 South Korean Models (MTXDOT-KR1) ........................26 Asia Pacific Models (MTXDOT-AS1) .......................... 27 Battery Draw Down..............................28 Electrical and Timing Characteristics ........................28 Measuring the Power Draw ............................29 Pin Information ................................30 Pin Information ................................. 30 Pull-Up/Down................................
  • Page 5 CONTENTS FCC Grant Notes................................ 46 Host Labeling................................47 Chapter 7 – Safety Information ..........................48 Handling Precautions ..............................48 Radio Frequency (RF) Safety ............................48 Sécurité relative aux appareils à radiofréquence (RF)....................48 Interference with Pacemakers and Other Medical Devices ..................49 Potential interference ...............................
  • Page 6 CONTENTS Chapter 13 – Design Considerations........................68 Noise Suppression Design ............................68 PC Board Layout Guideline ............................68 Electromagnetic Interference ............................ 68 Electrostatic Discharge Control........................... 69 Chapter 14 – Mounting xDots and Programming External Targets ................. 70 Mounting the Device on Your Board .......................... 70 Stencil..................................
  • Page 7 PRODUCT OVERVIEW Chapter 1 – Product Overview Overview The MultiConnect xDot (MTXDOT) is a LoRaWAN , low-power RF device, capable of two way communication over long distances, deep into buildings, or within noisy environments using the unlicensed ISM bands in North America, Europe and worldwide.
  • Page 8 USB drive, and reset the xDot. On the xDot mbed page, MultiTech supplies source code for non-RF portions of the xDot. To comply with FCC and ETSI certification, some portions of the software is available only as binary libraries.
  • Page 9 Extended Unique Identifier (EUI). To query the device for the EUI, AT+DI: AT+DI=<8-BYTE-HEX-MSB> AT+DI=001122AABBCCDDEE For information on setting up xDots as part of a LoRa network, go to www.multitech.net. Configuration Persistence To safeguard your configuration, the device offers configuration persistence in the form of configuration redundancy and wear leveling.
  • Page 10 PRODUCT OVERVIEW Product Build Options Product Description Package Quantity North America MTXDOT-NA1-A00 915 MHz LoRa Module UFL/TRC (NAM) 1, 100, or 1000 MTXDOT-NA1-A01 915 MHz LoRa Module TRC (NAM) 1, 100, or 1000 EMEA MTXDOT-EU1-IN1-A00 868 MHz LoRa Module UFL/TRC (EU) 1 or 100 MTXDOT-EU1-IN1-A01 868 MHz LoRa Module TRC (EU)
  • Page 11 GETTING STARTED Chapter 2 – Getting Started Getting Started with the xDot Developer Kit Getting started depends on what you want to do. By default, xDot ships with firmware that supports AT Commands that use the serial I/O. For AT Commands, refer to the separate MultiConnect Dots AT Command Reference Guide.
  • Page 12 GETTING STARTED AT Command Port: XR21V1410 USB UART You may need to install a driver for the debug port to function properly. Go to: https://developer.Mbed.org/handbook/Windows-serial-configuration On Mac systems, COM ports appear in the Device Manager as: /dev/cu.usbmodemx Where x is a string of numbers and possibly letters, ending in a number. The COM port with lower number is the AT command port and COM port with the higher number is the debug port.
  • Page 13 GETTING STARTED For the bootloader, create a file with the following content. (Actual size may vary, but needs to accommodate the bootloader size.) Name the file Mbed_app.json and place it in the root directory. "target_overrides": { "XDOT_L151CC": { "target.restrict_size": "0x8000" For the application, create a file with the following content.
  • Page 14 FOTA Chapter 3 – FOTA External Flash Components for FOTA AT firmware on the xDot supports FOTA when a compatible external flash component or block device is connected to the xDot. In this configuration, multicast and fragmentation sessions are managed by the xDot. Messages for multicast (port 200) and fragmentation (port 201) are handled by the xDot and are not passed through to the AT terminal.
  • Page 15 FOTA Conduit to update the firmware on many Dots at once using multicast and error correction packets. FOTA is still in its early stages of revision and does have potential problems, which are included in this topic. Note: FOTA is enabled by default. To start the FOTA process, the Conduit sends two setup downlinks to the Dot.
  • Page 16 FOTA Fragmentation During this stage, the device should only send uplinks as necessary, too many can cause excessive fragment loss. Applications on the device should not perform heavy processing activities during FOTA. Doing so can cause fragments to overlap and excessive fragment loss. The number of fragments required to send a file depends on the Data Rate.
  • Page 17 If AT+SLEEP is used during the FOTA session, the Dot will miss packets and the session will likely fail. The FOTA session sends down packets every 1.5 seconds (assuming no duty cycle) and parity packets every 3 seconds by default. For best results, Multitech recommends users suspend all normal Dot operations until the FOTA session is complete.
  • Page 18 FOTA If the Dot was able to reconstruct the file using parity fragments, it sends a CRC check to the Conduit. Check the Dot debug log for Sending CRC. If the Dot does not receive a response or the Conduit responds with CRC not correct, the Dot discards the file.
  • Page 19 FOTA To end a Multicast session that is in progress, use 'ps -A | grep mcm'. Find the PID associated with lora- mcm. Then use 'kill (pid of lora-mcm)'. Also send 'rm -r -f ~/.fota/'. Wiping out the .fota directory removes any future FOTA/multicast sessions scheduled that have not setup.
  • Page 20 MECHANICAL DRAWINGS WITH PINOUTS Chapter 4 – Mechanical Drawings with Pinouts xDot Note: The xDot development board uses a land pattern that matches the xDot land pattern in the previous image. All pads are 0.028 inches square except the large one, which is 0.098 inches x 0.028 inches. ®...
  • Page 21 SPECIFICATIONS AND PIN INFORMATION Chapter 5 – Specifications and Pin Information MTXDOT Specifications Category Description General Compatibility LoRaWAN 1.0.4 specifications Interfaces Note that pin functions are multiplexed. Up to 19 digital I/O Up to 10 analog inputs 2 DAC outputs Wake pin Reset pin Full UART...
  • Page 22 SPECIFICATIONS AND PIN INFORMATION Category Description Power Requirements Operating Voltage 2.4 to 3.57 V North American Models (MTXDOT-NA1) Category Description Radio Frequency ISM Bands US902-928 MHz Certifications and Compliance US: FCC Part 15 Class B Canada: ICES-003 Radio FCC 15.247:2015 FCC 15.109:2015 FCC 15.107:2015 Safety...
  • Page 23 SPECIFICATIONS AND PIN INFORMATION Category Description -127 dBm -129 dBm Greater link budget is possible with higher gain antenna. RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path. European Models (MTXDOT-EU) Category Description Radio Frequency ISM Bands...
  • Page 24 SPECIFICATIONS AND PIN INFORMATION Category Description Spreading Factor EMEA -121 dBm -124 dBm -127 dBm -130 dBm -133 dBm -135 dBm -137 dBm Greater link budget is possible with higher gain antenna. RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path.
  • Page 25 SPECIFICATIONS AND PIN INFORMATION Category Description Spreading Factor Australia -111 dBm -116 dBm -119 dBm -122 dBm -125 dBm -127 dBm -129 dBm Greater link budget is possible with higher gain antenna. RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path.
  • Page 26 SPECIFICATIONS AND PIN INFORMATION Category Description Spreading Factor India -121 dBm -124 dBm -127 dBm -130 dBm -133 dBm -135 dBm -137 dBm Greater link budget is possible with higher gain antenna. RFS_L125: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 125 kHz bandwidth using split Rx/Tx path.
  • Page 27 SPECIFICATIONS AND PIN INFORMATION Category Description -119 dBm -122 dBm -125 dBm -127 dBm -129 dBm Greater link budget is possible with higher gain antenna. RFS_L500: RF sensitivity, Long-Range Mode, highest LNA gain, LNA boost, 500 kHz bandwidth using split Rx/Tx path.
  • Page 28 SPECIFICATIONS AND PIN INFORMATION Battery Draw Down xDot battery life depends on many variables, including transmit power, data rate, sleep usage, and duty cycle. The following figure represents the current consumption in one possible application. Use the current consumption values from the following Electrical Characteristics table when calculating average power consumption.
  • Page 29 SPECIFICATIONS AND PIN INFORMATION Signal Description Conditions Typical Units Idle mode (no TX, no 11.1 RX), processor active TX, TXP=2 TX, TXP=11 62.5 TX, TXP=20 Maximum supply current. Transmitting at TXP=20, all peripherals active, no load on IO pins. VDD = 3.3V.
  • Page 30 SPECIFICATIONS AND PIN INFORMATION Pin Information Pin Information Note: Using the mbed platform expands your pin functionality options. ® xDot Developer Guide...
  • Page 31 SPECIFICATIONS AND PIN INFORMATION Pins are on a 0.07 inch grid, and are 0.028 inches square (except for upper left) The xDot is 0.045 x 0.045, board is 0.93 x 0.93 xDot Pin STM32L151CCU6 (Where SW Name Notes applicable) PB12 SPI_NSS PB13 SPI_SCK...
  • Page 32 SPECIFICATIONS AND PIN INFORMATION Pull-Up/Down xDot Pin Pin Name SW Name PU/PD NRST 10k PU PA15 LORA_NSS 100k PU BOOT0 10k PD LORA_SCK 100k PD LORA_MOSI 100k PD LoRa Function LORA_DIO0 LORA_DIO1 LORA_DIO2 LORA_DIO3 PC13 LORA_DIO4 LORA_MISO LORA_MOSI PA15 LORA_NSS LORA_RESET LORA_SCK Crystals/Oscillator...
  • Page 33 SPECIFICATIONS AND PIN INFORMATION Description GPIO3 Wake Deep Sleep Wake Wake Interrupt Limitations Due to the processor's architecture, only one port of the same number (e.g. PA_1, PB_1, PC1, etc) may be configured as an Interrupt source. If you configure multiple ports of the same number as an Interrupt source, only the last one configured will actually trigger an interrupt in the processor.
  • Page 34 SPECIFICATIONS AND PIN INFORMATION xDot Pinout Design Notes Refer to the mechanical drawing for your model for pin locations. All pins that go to connectors are directly connected to the processor. Refer to Pin Information table for pull up and pull down information. xDots allow you to program pins depending on your application: Serial: Available out of the box.
  • Page 35 SPECIFICATIONS AND PIN INFORMATION The following table provides example settings and the theoretical maximum range based on these settings. Example 18dB Transmit Power for Units Example 14dB Transmit Power for 915 MHz Models 868MHz Models Frequency TX Power TX Antenna Gain RX Sensitivity -120 -120...
  • Page 36 SPECIFICATIONS AND PIN INFORMATION Resetting the xDot To reset the xDot Drive the RESET signal low for at least T NRESET Select either: Allow RESET to float. The internal pull-up resistor pulls it up. Drive the RESET line high. The processor starts executing code after the RESET line is high. ®...
  • Page 37 ANTENNAS Chapter 6 – Antennas Antenna System The LoRa antenna performance depends on the implementation and antenna design. The integration of the antenna system into the product is a critical part of the design process; therefore, it is essential to consider it early so the performance is not compromised.
  • Page 38 ANTENNAS LoRa Antenna Manufacturer: PulseLarsen Antenna Description: 868-928 MHz RP-SMA Antenna, 8" Model Number: W1063 MultiTech ordering information: Ordering Part Number Quantity AN868-915A-1HRA AN868-915A-10HRA AN868-915A-50HRA LoRa Antenna Specifications Category Description Frequency Range 868-928 MHz Impedance 50 Ohms VSWR < 2.0 Gain 1.0 dBi...
  • Page 39 ANTENNAS RSMA-to-U.FL Coaxial Cables Coaxial Cable Specifications Optional antenna cables can be ordered from MultiTech Cable Type Coaxial Cable Attenuation <1.0db Connector Impedance 50 ohm Maximum Cable Length 16" (40 cm) Ordering Information Part Number Description CARSMA-UFL-1 RSMA-to-UFL Coax Cable (Single Pack)
  • Page 40 ANTENNAS Ethertronics Chip Antenna This is the developer board's default antenna. Manufacturer: Ethertronics Description: 915MHz Chip RF Antenna 902MHz ~ 928MHz 2.56dB Solder Surface Mount Model Number: M620720 Datasheet: https://www.ethertronics.com/wp-content/uploads/2016/11/M620720-ISM-868- 915MHz-Ethertronics-Savvi-Ceramic-antenna-datasheet-20161020.pdf Antenna Specifications Category Description Electrical Specifications Frequency Range 868-870 MHz, 902-928 MHz Peak Gain 2.56 dBi VSWR...
  • Page 41 ANTENNAS Stackup Table Impedance Polar trial balance (L1 refer to L2) impedance 50.87 ohms, using 11 mil tracs, 22mil space. ® xDot Developer Guide...
  • Page 42 ANTENNAS Polar trial balance (L1 refer to L2/L4 refer to L3) impedance 93.54 ohms, using 8 mil tracs, 7mil space. ® xDot Developer Guide...
  • Page 43 ANTENNAS Chip Antenna Design Guidelines When designing antenna placement for the chip antenna, note the following: The antenna's long side must be along the edge of the ground plane. Remove the ground plane from all layers below the antenna. The distance from the antenna to the enclosure or plastic cover should be greater than 1.5 mm. The distance from the antenna to relatively large perturbations, such as a shield or large components, depends on the height of surrounding components.
  • Page 44 ANTENNAS Antenna Pad Layout PCB Layout ® xDot Developer Guide...
  • Page 45 ANTENNAS Antenna Matching Network The following images come from the xDot Developer Board schematics and show component populations for the antenna tuning circuit. The values you use depend on which frequency band you are using, 898 MHz or 915 MHz ®...
  • Page 46 ANTENNAS OEM Integration FCC & IC Information to Consumers The user manual for the consumer must contain the statements required by the following FCC and IC regulations: 47 C.F.R. 15.19(a)(3), 15.21, 15.105 and RSS-Gen Issue 4 Sections 8.3 and 8.4. FCC Grant Notes The OEM should follow all the grant notes listed below.
  • Page 47 ANTENNAS Note: Host design configurations constituting a device for portable use (<20 cm from human body) require separate FCC/IC approval. Host Labeling The following statements are required to be on the host label: This device contains FCC ID: AU792U13A16858 This device contains equipment certified under IC: 125A-0055 For labeling examples, see Cellular Approvals and Labeling Requirements.
  • Page 48 SAFETY INFORMATION Chapter 7 – Safety Information Handling Precautions To avoid damage due to the accumulation of static charge use proper precautions, such as an ESD strap, when handling any cellular device to avoid exposure to electronic discharge during handling and mounting the device. Radio Frequency (RF) Safety Due to the possibility of radio frequency (RF) interference, it is important that you follow any special regulations regarding the use of radio equipment.
  • Page 49 Do not expose the device to water, rain, or spilled beverages. It is not waterproof. Exposure to liquids could result in damage to the device. Using accessories, such as antennas, that MultiTech has not authorized or that are not compliant with the device's accessory specifications may invalidate the warranty.
  • Page 50 SAFETY INFORMATION If the device is not working properly, contact MultiTech Technical Support. User Responsibility Respect all local regulations for operating your wireless device. Use the security features to block unauthorized use and theft. End user must operate product per country laws and rules ®...
  • Page 51 Council Directive 2014/53/EU on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity. MultiTech declares that this device is in compliance with the essential requirements and other relevant provisions of Directive 2014/53/EU. The declaration of conformity may be downloaded at https://www.multitech.com/red...
  • Page 52 REGULATORY INFORMATION This device is open development based product that contains a sub GHz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others. (e.g. FCC 15.247:2015 & IC RSS-210:2010) MTXDOT-x products are open development based products that contain a sub ghz radio technology. MultiTech has certified for compliance with US and Foreign compliance bodies including FCC, R&TTE and others.
  • Page 53 REGULATORY INFORMATION Industry Canada Class B Notice This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Reglement Canadien sur le matériel brouilleur. This device complies with Industry Canada license-exempt RSS standard(s). The operation is permitted for the following two conditions: the device may not cause interference, and this device must accept any interference, including interference that may cause undesired operation of...
  • Page 54 Substances) complements the WEEE Directive by banning the presence of specific hazardous substances in the products at the design phase. The WEEE Directive covers all MultiTech products imported into the EU as of August 13, 2005. EU-based manufacturers, distributors, retailers and importers are obliged to finance the costs of recovery from municipal collection points, reuse, and recycling of specified percentages per the WEEE requirements.
  • Page 55 2015/863 of the European Parliament (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment - RoHS 3). These MultiTech products do not contain the following banned chemicals Lead, [Pb] < 1000 PPM Mercury, [Hg] <...
  • Page 56 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards In accordance with China's Administrative Measures on the Control of Pollution Caused by Electronic Information Products (EIP) # 39, also known as China RoHS, the following information is provided regarding the names and concentration levels of Toxic Substances (TS) or Hazardous Substances (HS) which may be contained in Multi-Tech Systems Inc.
  • Page 57 ENVIRONMENTAL NOTICES Information on HS/TS Substances According to Chinese Standards (in Chinese) 依 依 照 照 中 中 国 国 标 标 准 准 的 的 有 有 毒 毒 有 有 害 害 物 物 质 质 信 信 息 息 根据中华人民共和国信息产业部...
  • Page 58 (2) this device must accept any interference received, including interference that may cause undesired operation. The label shown is not the actual size. 1 - MultiTech Model Identification. 2 - MultiTech Ordering Part Number. 3 - Device Node Number. Example xDot Device Label Example Developer Board Device Label ®...
  • Page 59 DEVELOPER KIT OVERVIEW Chapter 11 – Developer Kit Overview xDot Developer Kit The xDot developer kit comes with an xDot already mounted on the developer board. Simply plug the developer kit into a USB port on your computer to test, program, and evaluate your application. Developer Kit Package Contents Your Developer Kit (MTMDK-NX-XDOT-xx) includes the following: Developer Board...
  • Page 60 DEVELOPER KIT OVERVIEW xDot Developer Kit Mechanical Drawings Note: The Reset and Wake buttons reset and wake the xDot processor. ® xDot Developer Guide...
  • Page 61 DEVELOPER KIT OVERVIEW Micro Developer Board LEDs Description LED1 User-definable LED. LED3/SDA Programming Status. LED2/PWR Power, blue light when the board has power. LED4/PROXY LED for the proximity sensor, which is next to it (labeled U14 on the top assembly diagram).
  • Page 62 DEVELOPER BOARD SCHEMATICS Chapter 12 – Developer Board Schematics Assembly Diagrams and Schematics Assembly Diagrams ® xDot Developer Guide...
  • Page 63 DEVELOPER BOARD SCHEMATICS Bottom ® xDot Developer Guide...
  • Page 64 DEVELOPER BOARD SCHEMATICS Schematics ® xDot Developer Guide...
  • Page 65 DEVELOPER BOARD SCHEMATICS ® xDot Developer Guide...
  • Page 66 DEVELOPER BOARD SCHEMATICS ® xDot Developer Guide...
  • Page 67 DEVELOPER BOARD SCHEMATICS ® xDot Developer Guide...
  • Page 68 DESIGN CONSIDERATIONS Chapter 13 – Design Considerations Noise Suppression Design Adhere to engineering noise-suppression practices when designing a printed circuit board (PCB). Noise suppression is essential to the proper operation and performance of the modem and surrounding equipment. Any OEM board design must consider both on-board and off-board generated noise that can affect digital signal processing.
  • Page 69 Take precautions to avoid exposure to electrostatic discharge during handling. MultiTech uses and recommends that others use anti-static boxes that create a faraday cage (packaging designed to exclude electromagnetic fields). MultiTech recommends that you use our packaging when returning a product and when you ship your products to your customers.
  • Page 70 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Chapter 14 – Mounting xDots and Programming External Targets Mounting the Device on Your Board A footprint diagram is included on the xDot Mechanical Drawing in Chapter 4. Stencil Match the stencil aperture size and layout to the mechanical footprint of the xDot (1:1). We recommend a stencil thickness of 5 mil.
  • Page 71 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Setpoints (Celsius) Zone Bottom Conveyer Speed 32.0 inch/minute Max Rising Slope Max Falling Slope Soak Time 150- Peak Temp Total Time /218C 170C Position Slope Slope Time Temp Time <TC2> 1.38 -0.63 28.82 240.22 -30% 43.61 -55%...
  • Page 72 MOUNTING XDOTS AND PROGRAMMING EXTERNAL TARGETS Blue arrows point to slots for the xDot first and last serial number positions on the tray and the serial number flow through the tray. In-System Programming of xDot You can use the xDot developer board to in-system program an xDot on your custom board. To do this, your board must implement a 9-pin header for the JTAG SWD and Mbed debug serial signals.
  • Page 73 Recommended Programming Hardware for Production Note: MultiTech does not recommend using the MTMDK-XDOT developer board for production programming. It doesn't have ESD protection, isn't enclosed, and wasn’t tested to be a robust solution for production. MultiTech recommends using the following programming hardware for production: Segger J-Link programmer - SEG-JLINK https://www.segger.com/products/debug-probes/j-link...
  • Page 74 APPENDIX A RELEASE NOTE ARCHIVE Appendix A – Appendix A Release Note Archive What's New in Firmware Version 3.2 The new release includes the following changes: LoRaWAN Version 1.0.3 Class B support Russian channel plan support New and updated AT Commands LoRaWAN Version 1.0.3 Class B Support The LoRaWAN Class B option allows devices to open receive windows at fixed time intervals for server-initiated downlink messages.
  • Page 75 APPENDIX A RELEASE NOTE ARCHIVE ACK Enabled Power/Datarate Back-off: When you enabled ACK, back-off uses ADR Limit and Delay settings. ACK Retries LinkADRReq sets the number of retries with the nbTrans field. This also increases the maximum retries to 15. Join Dev and App Nonce: Join Dev Nonce increments with each Join Request sent Join App Nonce is validated to increment with each Join Accept received...
  • Page 76 APPENDIX A RELEASE NOTE ARCHIVE What's New in Firmware Version 4.0 The new release includes the following changes: Configuration Persistence FOTA Enhancements New and updated AT Commands Configuration Persistence To safeguard your configuration, the device offers configuration persistence in the form of configuration redundancy and wear leveling.
  • Page 77 APPENDIX A RELEASE NOTE ARCHIVE From reducing the AT command set and limiting response output: Removed all help text. Removed all commands with =?. Removed AT&V - Displays device settings and status. Removed AT&S - Displays device statistics. For an archive of release notes, go to Appendix A. ®...
  • Page 78 INDEX Index schematics Developer Board ...........62 electrical characteristics..........28 electromagnetic interference ........68 electrostatic discharge ..........69 EMI ................68 antenna ..............37 38 ESD ................69 developer board ............40 EUI ...................9 antenna design guidelines ..........43 external targets.............72 assembly diagrams Developer Board ............62 AT command port ................11 grant notes...............46 FCC Notice Class B ..............51...
  • Page 79 INDEX receive sensitivity............21 related products..............7 labeling reset ................36 host ................46 ribbon cable ..............72 labels ................58 RoHS................55 Linux ................11 RSMA-to-UFL cable ............39 LoRa range ................34 safety RF interference ............48 Mac ................11 safety standards............68 maintenance ..............49 serial settings ..............34 mbed ................8 solder profile ..............70 mechanical drawings.............20 specifications..............21 Micro Developer Board..........60...

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