Summary of Contents for Texas Instruments THS4503EVM
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THS4503EVM User’s Guide June 2002 SLOU132...
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Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.
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EVM IMPORTANT NOTICE Texas Instruments (TI) provides the enclosed product(s) under the following conditions: This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods.
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EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch. Copyright 2002, Texas Instruments Incorporated Mailing Address: Texas Instruments...
It is recommended that the user initially review the data sheet of the device under test. It is helpful to review the schematic and layout of the THS4503EVM to determine the design techniques used in the evaluation board. It is recommended that the user review the application note Fully Differential Amplifiers (literature number SLOA054) to learn more about differential amplifiers.
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Related Documentation From Texas Instruments This is an example of a warning statement. A warning statement describes a situation that could potentially cause harm to you. The information in a caution or a warning is provided for your protection. Please read each caution and warning carefully.
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Application report (literature number SLMA002), Power Pad Thermally Enhanced Package, http://www−s.ti.com/sc/psheets/slma004/slma002.pdf Application report (literature number SLMA004), Power Pad Made Easy, http://www−s.ti.com/sc/psheets/slma004/slma004.pdf Application report (literature number SSYA008), Electrostatic Discharge (ESD), http://www−s.ti.com/sc/psheets/ssya008/ssya008.pdf Trademarks PowerPAD is a trademark of Texas Instruments. Trademarks...
..............Evaluation Module Features THS4503EVM Operating Conditions EVM Default Configuration Using the THS4503EVM .
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............3−3. Output of an AC-Coupled, Single-Supply Application 5−1. Top Layer 1 (Signals for THS4503EVM) 5−2. Bottom Layer 2 (Ground and Signal) 5−3.
THS4503 fully differential operational amplifier (FDA). Also, this EVM is a good example of high-speed PCB design. This document details the THS4503EVM. It includes a list of EVM features, a brief description of the module illustrated with a series of schematic diagrams, EVM specifications, details on connecting and using the EVM, and a discussion of high-speed amplifier design considerations.
Description 1.1 Description The THS4503EVM provides a platform for developing high-speed FDA application circuits. It contains the THS4503 high-speed FDA, a number of passive components, and various features and footprints that enable the user to experiment, test, and verify various operational amplifier circuit implementations.
1.4 EVM Default Configuration As delivered, the EVM has a fully functional example circuit, just add power supplies, a signal source, and monitoring instrument. See Figure 1−1 for the default schematic diagram. The user can change the gain by changing the ratios of the feedback and gain resistors (see the device data sheet for recommended resistor values).
Using the THS4503EVM This section describes how to connect the THS4503EVM to test equipment. It is recommended that the user connect the EVM as described in this section to avoid damage to the EVM or the THS4503 installed on the board.
Required Equipment 2.1 Required Equipment One dual-output dc power supply (±5 V, 1 A output minimum) Two dc current meters with resolution to 1 mA and capable of the maximum current the dc power supply can supply. 50-Ω source impedance function generator (1 MHz, 10 V Oscilloscope (50-MHz bandwidth minimum, 50-Ω...
2) Using a BNC-to-SMA cable, connect the oscilloscope channel 1 to J2 (VOUT+). 3) Using a BNC-to-SMA cable, connect the oscilloscope channel 2 to J3 (VOUT−). Figure 2−2. Signal Connections (Refer to Figure 2−2) Using the THS4503EVM Function Generator Setup ) sine wave...
THS4503EVM Applications Example applications are presented in this chapter. These applications dem- onstrate the most popular circuits, but many other circuits can be constructed. The user is encouraged to experiment with different circuits, exploring new and creative design techniques. After all, that is the function of an evaluation board.
3.1 Single-Ended In/Single-Ended Out, Utilizing Transformer The fully differential amp output can be monitored by a single-ended instrument at J4. The THS4503EVM utilizes Mini-Circuits CD542 footprint transformers to make the fully differential to single-ended conversion. An ADP4−1WT transformer is installed on the board.
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This circuit allows the input voltage to swing below the negative power supply rail of the op-amp, as shown in Figure 3−3. Single-Ended to Fully Differential Application Vocm 392 W R6 0 − Vocm R7 0 THS4503 392 W THS4503EVM Applications Vout+ Vout−...
This application circuit has interaction between R Texas Instruments has provided an engineer design utility to facilitate the design of these circuits. Engineer design utilities are available on the Am- plifiers and Comparators section of the Analog and Mixed Signal portion of the TI web page.
Chapter 4 High Speed Amplifier PCB Layout Tips The THS4503EVM layout has been designed for use with high-speed signals and can be used as an example when designing PCBs incorporating the THS4503. Careful attention has been given to component selection, grounding, power supply bypassing, and signal path layout.
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Circuit pathways should be made as symmetrical as possible for both feedback pathways to minimize second and other even-harmonic content. The printed-circuit board used with PowerPAD packages must have features included in the design to remove the heat from the package efficiently. As a minimum, there must be an area of solder-tinned-copper underneath the PowerPAD package.
This chapter describes the EVM hardware. It includes the EVM parts list, and printed circuit board layout. Table 5−1. THS4503EVM Bill of Materials Size Item Description CAP, 6.8 µF, tanatalum, 35 V, 10% CAP, 0.1 µF, ceramic, 0508 X7R, 16 V...
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