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Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Screwdriver #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1.
Slide the battery latch to the unlock position and disassemble battery
2.
Loosen HDD cover set (screw * 1) and remove HDD cover.
3.
Loosen DDR cover set (screw * 1) and remove DDR Cover.
4.
Loosen ODD (screw * 1), take out the ODD and Remove the (rubber * 2) on BTCB.
5.
Disconnect HDD FFC on M/B and pull up the HDD, then take it out.
6.
Disassemble WLAN cable from WLAN module / Loosen WLAN module screw and take out the WLAN module.
7.
Loosen (screw * 1) and take out the mSATA.
8.
Disassemble DDR and disassemble fan CNTR
9.
Loosen BTCB (screw * 18)
10. Poke the position(K/B FFC), then turn the computer over and disconnect K/B FFC, then remove the K/B.
11. Disassemble TPCB.
12. Rip the tape and rip the gasket then disassemble FP.
13. Loosen (screw * 1) and disassemble SD card/B.
14. Loosen (screw * 1) and rip the gasket, then disassemble power/B
15. Loosen (screw * 2) and disconnect TP FFC from TP module then disassemble pick button/B.
16. Rip the tapes and disconnect speaker cable then disassemble speaker
17. Loosen (screw* 1) and disconnect FFC from M/B then disassemble USB/B.
18. Rip the fan mylar and loosen (screw * 2) then disassemble fan.
19. Disconnect LVDS cable and rip gasket and tape.
20. Loosen M/B (screw * 4) and take out the M/B.
21. Loosen (screws left * 3) & (screws right * 4) and disassemble antenna from hooks, then separate LCM from BTCB.
22. Remove (mylar* 2)Loosen (screw* 2) then disassemble bezel.
23. Loosen (screw * 4) and disconnect LVDS cable.
24. Disassemble hinge bracket – L/R.
25. Loosen (screw * 4).
26. Disassemble antenna cables.
27. Take out the camera module from BTDL and disconnect cable from camera.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.21 Total part disassembly
3.22 Remove battery module
3.23 Remove service door
EL-MF877-00
Template Revision B
PSG instructions for this template are available at
EL-MF877-01
Tool Size (if
applicable)
Type-cross
#1
Page 2
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