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HP RP5000 Disassembly Instructions Manual

Small form factor, atx, point-of-sale, rpos
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HP-00007-01, Appendix 3
Appendix 3 Product End-of-Life Disassembly instructions
Product Identification:
Marketing Name / Model
RPOS/RP5000
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the
basic instructions for the disassembly of HP products to remove components and materials requiring
selective treatment.
1.0
Items Requiring Selective Treatment
1.1
Items listed below are classified as requiring selective treatment.
1.2
Enter the quantity of items contained within the product which require selective treatment in
the right column, as applicable.
Item Description
Printed Circuit Boards (PCB) or Printed
Circuit Assemblies (PCA)
Batteries
Mercury containing components
Liquid Crystal Displays (LCD) with a
surface greater than 100 square cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing
PCB / PCT)
Electrolytic Capacitors / Condensers
greater than 2.5 cm in diameter or hght
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame
Retardants
Components and parts containing toner
and ink, including liquids, semi-liquids
(gel/paste) and toner
Components & waste containing
asbestos
Components, parts and materials
containing refractory ceramic fibers
Components, parts and materials
containing radioactive substances
Description
Small Form Factor, ATX, Point-of-Sale
Notes
With a surface greater than 10
square cm
All types including standard
alkaline and lithium coin or button
style batteries
For example, mercury in lamps,
display backlights, scanner lamps,
switches, batteries
Includes background illuminated
displays with gas discharge lamps
Include the cartridges, print
heads, tubes, vent chambers, and
service stations.
HP Restricted
30-Jun-2005
Qty items in
product.
4 PCS
- system bd
- pwr supply bd
- USB+Power bd
- riser card
1 PCS
0
0
0
0
0
0
0
0
0
0
0
0
Page 1

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  Summary of Contents for HP RP5000

  • Page 1 Small Form Factor, ATX, Point-of-Sale Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment. Items Requiring Selective Treatment Items listed below are classified as requiring selective treatment.
  • Page 2 HP-00007-01, Appendix 3 30-Jun-2005 Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable)
  • Page 3 HP-00007-01, Appendix 3 30-Jun-2005 POWER SUPPLY PCA To remove the power supply from the chassis: a) Remove the screw on the left side that secures the rear panel to the chassis (see Figure 11 below). b) Remove the two screws on the right side that secure the rear panel to the chassis and to the power supply (see Figure 12 below).
  • Page 4 HP-00007-01, Appendix 3 30-Jun-2005 ILLUSTRATIONS FIGURE 1: Removing the access panel FIGURE 2: Removing the front bezel FIGURE 3: Front bezel removal tabs FIGURE 4: Rotating the drive cage FIGURE 5: Riser card cage FIGURE 6: Removing the riser card cage...
  • Page 5 HP-00007-01, Appendix 3 30-Jun-2005 FIGURE 7: Releasing the slot cover retention latch FIGURE 8: Loosening the USB+Power card FIGURE 9: Removing the USB+Power card FIGURE 10: System board tray/label FIGURE 11: Rear panel screw – left side FIGURE 12: Rear panel screws – right side...
  • Page 6 HP-00007-01, Appendix 3 30-Jun-2005 FIGURE 13: Rear panel removed FIGURE 14: Removing the power supply Slide toward back of chassis FIGURE 15: Power supply FIGURE 16: Power supply with sides removed HP Restricted Page 6...
  • Page 7 HP-00007-01, Appendix 3 30-Jun-2005 FIGURE 17: Power supply PCA screw locations FIGURE 18: Power supply PCA screw locations FIGURE 19: Removing the battery holder HP Restricted Page 7...