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PACKAGE DESCRIPTION
Please refer to
http://www.linear.com/product/LTC3875#packaging
3.50 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
5.00 ±0.10
(4 SIDES)
PIN 1 TOP MARK
(SEE NOTE 5)
NOTE:
1. DRAWING CONFIRMS TO JEDEC PACKAGE OUTLINE MO-220
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
40-Lead Plastic QFN (5mm × 5mm)
(Reference LTC DWG # 05-08-1746 Rev B)
0.70 ±0.05
3.60 REF
(4 SIDES)
3.50 ±0.05
PACKAGE OUTLINE
0.20 ±0.05
0.40 BSC
0.75 ±0.05
For more information
for the most recent package drawings.
UH Package
5.50 ±0.05
4.10 ±0.05
R = 0.100
R = 0.05
TYP
3.50 ±0.10
3.60 REF
(4-SIDES)
0.200 REF
0.00 – 0.05
BOTTOM VIEW—EXPOSED PAD
www.linear.com/LTC3875
LTC3875
TYP
39
40
PIN 1 NOTCH
R = 0.30 TYP
OR 0.35 × 45°
CHAMFER
3.50 ±0.10
0.20 ± 0.05
0.40 BSC
0.40 ±0.10
1
2
(UH40) QFN REV B 0415
3875fb
43
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