Figure 41: Reflow Soldering Profile - Quectel UG95 Hardware Design

It is suggested that peak reflow temperature is 235 ~ 245º C (for SnAg3.0Cu0.5 alloy). Absolute max
reflow temperature is 260º C. To avoid damage to the module when it was repeatedly heated, it is
suggested that the module should be mounted after the first panel has been reflowed. The following
picture is the actual diagram which we have operated.
º C
250
217
200
150
100
50
0
UG95_Hardware_Design
Preheat
Liquids Temperature
160
º C
Between 1~3 /s
º C
50 100

Figure 41: Reflow Soldering Profile

Confidential / Released
200
º C
70s~120s
150 200
Time
UMTS/HSPA Module Series
UG95 Hardware Design
Heating Cooling
40s~60s
250 300
s
63 / 72