Rack; Cables - Siemens SIMATIC TDC System Manual

Installation and EMC guidelines

1.15 Rack

1.15 Rack
● The rack must be bonded to the grounding/equipotential busbar using the shortest
possible conductor with a minimum cross-section of 16 mm
bonding (Page 22).
● All modules and front panels must be screwed onto the rack. This rule also applies to
commissioning phase!
● Unused slots must be provided with SIMATIC TDC dummy front panels type SR 51 6DD
1682-0DA1.
● The connectors must be screwed/interlocked to the front panel.
● The limit of the air intake temperature may not be exceeded on the rack; refer to Control
cabinet (Page 20). The rack must be installed in a way that safely excludes heat
accumulation; refer toFire protection (Page 18).
● The air intake of the rack must be free of dust as far as possible. The air intake of the
rack (bottom) must be cleaned at cyclic intervals depending on the degree of soiling.
Note
The modules may not be inserted or removed while the rack is on live voltage. Exception:
Memory sub-modules MC 5xx / MMCs.
As a matter of principle it is not advisable to remove and insert memory sub-modules or
front connectors on the live component.
For module-specific notes, refer to the corresponding user documentation (hardware).
1.16

Cables

● All signal cables you install must be shielded. All cables assembled by users must be
wired with strain relief.
● Serial signal lines must be shielded. The shield must be bonded to a metalized connector
housing, as well as to the shielding busbar. The cable shielding may not be wired to pin 1
of the connector.
● The power cable for the rack power supply does not require shielding. The permitted
operating voltage of the power cable used may not be less than the supply voltage.
● Power supply cables for safety extra low voltages (e.g. 24 V DC) must be shielded. A
power supply cable that is routed via interface module must be bonded to the shielding
busbar as specified in section "Connection via interfacee module".
● External power supply ground must be bonded to the equipotential busbar; refer to
"Equipotential bonding (Page 22)".
● Cables on system side and cables interconnecting the interface module with SIMATIC
TDC should not be routed through the same cable duct.
● A minimum clearance of > 10 cm must be maintained between signal lines and power
cables carrying voltages less than 500 V and > 30 cm to power cables carrying voltages
of more than 1 kV.
32
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System Manual, 08/2017, A5E01114865-AL
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