Thermal Design Guide - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
3. Place the plug cable assembly (held in the tool) over the corresponding
receptacle.
4. Assure that the plug and receptacle are aligned press-down perpendicular to the
mounting surface until both connectors are fully mated.
5. Remove the mating tool by pulling it up carefully.
Figure 6-4 Unmating the plug


It is recommended not to apply any pull forces after the bending of the cable, as
described in Figure 6-5 .
Figure 6-5 Do not apply any pull forces after the bending of the cable

6.7 Thermal Design Guide

When using in the network, the MU709 module (Mini PCIe) have high power
consumption. To improve the module reliability and stability, focus on the thermal
design of the device to speed up heat dissipation.
Take the following heat dissipation measures:

Do not hollow out the customer PCB.

Attach the thermal conductive material between the Mini PCIe and the customer
PCB. The recommended thermal conductivity of the thermal conductive material
is 1.0 W/m-k or higher (recommended manufacturers: Laird and Bergquist). The
The extraction tool is recommended.
Any attempt of unmating by pulling on the cable may result in damage and influence the
mechanical/electrical performance.
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd
Issue 04 (2015-06-25)
Mechanical Specifications
53