Audio Interface; Overview - Huawei MU709 Series Hardware Manual

HUAWEI MU709 Series HSPA+ Mini PCIe Module
Hardware Guide
capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.

It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.

3.7 Audio Interface

3.7.1 Overview

The MU709 module provides one PCM digital audio interface. Table 3-7 lists the
signals on the digital audio interface.
Table 3-7 Signals on the digital audio interface
Pin Pin Name
No.
45 PCM_CLK
47 PCM_DOUT
49 PCM_DIN
51 PCM_SYNC
The MU709 module interface enables communication with an external codec to
support linear format.
Pad Description
Type
O PCM clock
O PCM I/F data output
I PCM I/F data input
O PCM interface sync
Description of the Application Interfaces
Parameter
Min.(V)
V –0.3
OL
V 1.35
OH
V –0.3
OL
V 1.35
OH
V –0.3
IL
V 1.17
IH
V –0.3
OL
V 1.35
OH
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd
Issue 04 (2015-06-25)
Typ.(V) Max.(V)
0 0.45
1.8 2.1
0 0.45
1.8 2.1
0 0.63
1.8 2.1
0 0.45
1.8 2.1
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