Hardware Integration Guide
3.3.3.
Footprint
The AirPrime AR7558 device LGA footprint is a 303 pad array of 0.9mm, 1.45mm, and 1.90mm pads.
The following drawing illustrates the device footprint. The application footprint is recommended to
mirror the device footprint as illustrated in the following drawing (subject to change).
Figure 4.
AirPrime AR7558 Footprint
Figure 5.
AirPrime AR7558 Recommended Application Land Pattern
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Rev 1.1
Hardware Specifications
January 21, 2015
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