Siemens SIMATIC IFP2200 INOX MT ETH Compact Operating Instructions page 26

Hmi devices
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Maintenance and care
4.2 Working with pressure washers
Cleaning guidelines
If possible, do not clean the HMI device directly and repeatedly with a pressure washer.
● Use only clean water.
● Cover sensitive areas beforehand.
When cleaning with a pressure washer, you need to ensure that you can manually regulate
the pressure. The pressure washer must be set in such a way that it prevents any damage to
the HMI device.
● Avoid pressures > 100 bar
● Avoid temperatures > 80°C
● Use only nozzles suitable for the device and the objects to be cleaned, for example, the
machine, container or floor and that are suitable for this purpose.
A fan nozzle is suitable for the machine, for example, a spot jet nozzle is unsuitable.
Refer to the manufacturer's documentation.
● If necessary, use a flat jet nozzle and keep a distance of at least 30 cm.
NOTICE
Observe the ambient conditions
During cleaning work, observe the permissible ambient conditions, especially the
temperature in operation.
We recommend the following cleaning temperatures:
● Slight soiling: 30-50 °C
● Protein-containing soiling: max. 60 °C
The HMI device may be damaged if the pressure is too high or concentrated at a singe point.
Avoid damage caused by excessive pressure when handling the pressure washer.
● Always keep the high-pressure jet in motion and work the surfaces quickly.
● Always aim the high-pressure jet first at the object to be cleaned from a greater distance.
● Do not aim the pressure washer directly at the device or the cleaning jet at a single point.
● Maintain a minimum distance of 30 cm from the device.
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Compact Operating Instructions, 03/2018, A5E42185570-AA
IFP2200 INOX MT ETH

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