Production Guidance; Reflow Soldering Temperature; Reflow Soldering Curve - Ebyte E73 2G4M04S1B User Manual

5. Production Guidance

5.1. Reflow Soldering Temperature

Profile Feature
Solder Paste
Preheat Temperature min （Tsmin）
Preheat temperature max (Tsmax)
Preheat Time (Tsmin to Tsmax)(ts)
Average ramp-up rate(Tsmax to Tp)
Liquidous Temperature (TL)
Time（tL）Maintained Above（TL）
Peak temperature（Tp）
Aveage ramp-down rate（Tp to Tsmax）
Time 25℃ to peak temperature

5.2. Reflow Soldering Curve

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Curve feature
Solder paste
Minimum preheating temperature
Maximum preheating temperature
Preheating time
Average rising rate
Liquid phase temperature
Time above liquidus
Peak temperature
Average descent rate
Time of 25 ° C to peak temperature
Sn-Pb Assembly Pb-Free Assembly
Sn63/Pb37 Sn96.5/Ag3/Cu0.5
100℃
150℃
60-120 sec
3℃/second max 3℃/second max
183℃
60-90 sec
220-235℃
6℃/second max 6℃/second max
6 minutes max 8 minutes max
150℃
200℃
60-120 sec
217℃
30-90 sec
230-250℃
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