Samsung SCL Series Specification Sheet page 9

NO ITEMS
SOLDER TEMPERATURE : 245±5 ℃
DIP TIME : 3±0.5 SEC.
SOLDERABILITY
12 SOLDER : Sn-3Ag-0.5Cu
[Pb-free]
FLUX : ROSIN(KSM2951)+Solvent(ISA)
PREHEAT : 100 ∼ 110 ℃ FOR 30 SEC.
TEMPERATURE : 260±5 ℃
DIP TIME : 10 ±1 SEC
ALL SAMPLES SHALL BE DIPPED IN SOLDER
BATH. MEASUREMENT SHALL BE MADE AT
ROOM TEMPERATURE AFTER 1~2 HOURS OF
RESISTANCE
COOLING TIME.
13 TO SOLDERING
CONVECTION REFLOW
HEAT
PREHEAT : 150 ∼ 190 ℃ FOR 130 SEC.
PEAK TEMPERATURE : 260±5 ℃ FOR 10 SEC.
METHOD : SAMPLES SHALL BE PASSED
REFLOW 3 TIMES.
MEASUREMENT SHALL BE MADE AT ROOM
TEMPERATURE AFTER 3 ∼ 4 HOURS OF
COOLING TIME.
IMMERSION CLEANING
RESISTANCE
THE CAPACITOR SHALL BE CLEANED AT
TO
14
ROOM TEMPERATURE FOR 60sec. USING
CLEAN TEST
ISOPROPYL ALCOHOL
VIBRATION FREQUENCY : 10 to 55 to 10Hz (in 1 min.) MAX
AMPLITUDE : 1.5 mm.
DIRECTION OF VIBRATION : IN DIRECTION OF
X,Y AND Z AXES
TIME : 2 HOURS EACH DIRECTION AND 6
HOURS IN TOTAL
DURING THE LAST 30 min. OF VIBRATION IN
EACH DIRECTION, THE CAPACITANCE SHALL
15
BE MEASURED 3 TO 5 TIMES.
FOR OTHER PROCEDURES REFER TO IEC
Pub. 68-2-6.
TEST CONDITION
(ROSIN 25WT%)
MOUNTING METHOD
SOLDER
ALUMINA
BOARD
PERFORMANCE
MORE THAN 95% OF THE
TERMINAL SURFACE MUST BE
SOLDERED NEWLY.
CHANGE IN CAPACITANCE :
±5% OF INITIAL VALUE
TANGENT OF LOSS ANGLE :
LEAKAGE CURRENT :
APPEARANCE :
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. .
Change in capacitance:
±10% of initial value
Tangent of loss angle:
Leakage Current :
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. AND
MARKING SHALL BE LEGIBLE.
ELECTRICAL CHARACTERISTICS
SHALL SATISFY THE INITIAL
REQUIREMENT.
CHANGE IN CAPACITANCE :
WITHIN : ±5% OF THE INITIAL
VALUE
TANGENT OF LOSS ANGLE :
LEAKAGE CURRENT :
APPEARANCE :
THERE SHALL BE NO EVIDENCE
OF MECHANICAL DAMAGE. .