Packaging/Ordering Information - Texas Instruments TRF7960 Manual

TRF7960
TRF7961
SLOU186F – AUGUST 2006 – REVISED AUGUST 2010
TERMINAL
TYPE
NAME NO.
I/O_5 22
I/O_6 23
I/O_7 24
EN2 25
DATA_CLK 26
SYS_CLK 27
EN 28
VSS_D 29
OSC_OUT 30
OSC_IN 31
VDD_X 32
Thermal Pad
3.2

PACKAGING/ORDERING INFORMATION

PACKAGED DEVICES
TRF7960RHBT
TRF7960RHBR
TRF7961RHBT
TRF7961RHBR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package .
6 Physical Characteristics
Table 3-1. Terminal Functions (continued)
(1)
I/O pin for parallel communication
BID Strobe out clock for serial communication
Data clock output in direct mode
I/O pin for parallel communication
BID MISO for serial communication (SPI)
Serial bit data output in direct mode 1 or sub-carrier signal in direct mode 0
I/O pin for parallel communication.
BID
MOSI for serial communication (SPI)
Pulse enable and selection of power down mode. If EN2 is connected to VIN, then VDD_X is
INP active during power down to support the MCU. Pin can also be used for pulse wake-up from
power-down mode.
INP Clock input for MCU communication (parallel and serial)
Clock for MCU (3.39 / 6.78 / 13.56 MHz) at EN = 1 and EN2 = don't care
OUT
If EN = 0 and EN2 = 1, then system clock is set to 60 kHz
INP Chip enable input (If EN = 0, then chip is in power-down mode).
SUP Negative supply for internal digital circuits; normally connected to circuit ground
OUT Crystal oscillator output
INP Crystal oscillator input
OUT Internally regulated supply (2.7 V – 3.4 V) for external circuitry (MCU)
Connected to circuit ground
(2)
PACKAGE TYPE
RHB-32
RHB-32
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DESCRIPTION
(1)
TRANSPORT MEDIA
Tape and reel
Tape and reel
Tape and reel
Tape and reel
Copyright © 2006–2010, Texas Instruments Incorporated
TRF7960 TRF7961
www.ti.com
QUANTITY
250
3000
250
3000