Texas Instruments TRF7960 Manual page 45

Multi-standart fully integrated 13.56-mhz rfid analog front end and data-framing reader system
Hide thumbs Also See for TRF7960:
Table of Contents

Advertisement

www.ti.com
PACKAGING INFORMATION
Orderable Device
(1)
Status
TRF7960RHBR
ACTIVE
TRF7960RHBT
ACTIVE
TRF7961RHBR
ACTIVE
TRF7961RHBT
ACTIVE
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Package Type Package
Pins
Package Qty
Drawing
QFN
RHB
32
3000
QFN
RHB
32
250
QFN
RHB
32
3000
QFN
RHB
32
250
Addendum-Page 1
PACKAGE OPTION ADDENDUM
(2)
Lead/
Eco Plan
MSL Peak Temp
Ball Finish
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
Green (RoHS
CU NIPDAU Level-2-260C-1 YEAR
& no Sb/Br)
http://www.ti.com/productcontent
25-Jul-2012
(3)
Samples
(Requires Login)
for the latest availability

Advertisement

Table of Contents
loading

This manual is also suitable for:

Trf7961

Table of Contents