Bottom View - Samsung DDR3 User Manual

General Information
78Ball FBGA for 2Gb B-die (x4/x8)
9.00 ± 0.10
(Datum A)
0.80 1.60
9 8 7 6 5 4 3 2 1
A
B
C
(Datum B)
D
E
F
G
H
J
K
L
M
N
78 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B

BOTTOM VIEW

96Ball FBGA for 2Gb B-die (x16)
9.00 ± 0.10
0.80 1.60
9 8 7 6 5 4 3 2 1
A
(Datum A)
B
C
D
(Datum B) E
F
G
H
J
K
L
M
N
P
R
T
96 - ∅0.45 Solder ball
(Post Reflow ∅0.50 ± 0.05)
0.2 M A B
BOTTOM VIEW
A
#A1 INDEX MARK
3.20
(0.95)
MOLDING AREA
(1.90)
A
#A1 INDEX MARK
3.20
(0.95)
MOLDING AREA
(1.90)
9.00 ± 0.10
#A1
B
TOP VIEW
9.00 ± 0.10
#A1
B
TOP VIEW
DDR3 SDRAM
0.35 ± 0.05
1.10 ± 0.10
0.35 ± 0.05
1.10 ± 0.10
October 2009