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General Information
1. DDR3 SDRAM Component Ordering Information
K 4 B X X X X X X X - X X X X
SAMSUNG Memory
DRAM
DRAM Type
Density
Bit Organization
1. SAMSUNG Memory : K
2. DRAM : 4
3. DRAM Type
B : DDR3 SDRAM
4. Density
51 : 512Mb
1G :
1Gb
2G :
2Gb
4G :
4Gb
5. Bit Organization
04 : x 4
08 : x 8
16 : x16
6. # of Internal Banks
3 : 4 Banks
4 : 8 Banks
5 : 16 Banks
1
2
3
4
5
6
7
8
7. Interface ( V
, V
DD
6 : SSTL (1.5V, 1.5V)
8. Revision
M
: 1st Gen.
A
: 2nd Gen.
B
: 3rd Gen.
C
: 4th Gen.
D
: 5th Gen.
E
: 6th Gen.
F
: 7th Gen
G
: 8th Gen
H
: 9th Gen
9. Package Type
Z
: FBGA (Lead-free)
H
: FBGA (Halogen-free & Lead-free)
J
: FBGA (Lead-free, DDP)
M
: FBGA (Halogen-free & Lead-free, DDP)
10. Temp & Power
C
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
L
: Commercial Temp.( 0°C ~ 85°C) & Low Power
Y
: Commercial Temp.( 0°C ~ 85°C) & Low VDD(1.35V)
11. Speed
F7
: DDR3-800
F8
: DDR3-1066 (533MHz @ CL=7, tRCD=7, tRP=7)
H9
: DDR3-1333 (667MHz @ CL=9, tRCD=9, tRP=9)
: DDR3-1600 (800MHz @ CL=11, tRCD=11, tRP=11)
K0
DDR3 SDRAM
9
10
11
Temp & Power
Package Type
Interface (V
# of Internal Banks
)
DDQ
(400MHz @ CL=6, tRCD=6, tRP=6)
October 2009
Speed
Revision
, V
)
DD
DDQ
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