Related Manuals for Texas Instruments THS7001
Summary of Contents for Texas Instruments THS7001
- Page 1 THS7001 Programmable Gain Amplifier Evaluation Module User’s Guide December 1999 Mixed-Signal Products SLOU057...
- Page 2 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.
- Page 3 Preface Related Documentation From Texas Instruments THS7001 Programmable-Gain Amplifier (literature number SLOS214) This is the data sheet for the THS7001 amplifier integrated circuit used on the EVM. PowerPAD Thermally Enhanced Package (literature number SLMA002) This is the technical brief for the special PowerPAD package in which the THS7001 amplifier IC is supplied.
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Page 5: Table Of Contents
............... THS7001 Programmable-Gain Amplifier EVM Parts List . - Page 6 ........1-12 1–9 THS7001 EVM Preamplifier + PGA Response, VCC = 15 V ..... . 1-13 1–10...
- Page 7 1–9 Using the THS7001 EVM ........
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Page 8: General Information
The TI THS7001 programmable-gain amplifier evaluation module (EVM) is a complete low-noise receiver and a highly configurable programmable-gain amplifier circuit. It consists of the TI THS7001 programmable-gain amplifier IC and a number of passive parts, all mounted on a multilayer circuit board (Figure 1–1). -
Page 9: Ths7001 Evaluation Module
Description Figure 1–1. THS7001 Evaluation Module SLOP250 THS7001 EVM Board +V CC –V CC +5 V Pre-Amp A Output 1999 AVREF PGA – A Output Input C18, C10 C19, C9 Input power is applied to the EVM through banana jacks J1, J2, J3, and J4. An LC filter on each power bus isolates the EVM circuits from the external supply. - Page 10 Description General Information...
- Page 11 EVM board can be replaced with different values, it is imperative that the THS7001 preamplifier gain be kept to a minimum of +2 or –1 for stability purposes. Also, component pads have been placed in convenient locations on the PCB (shown as components with the value TBD in the schematic) to allow numerous modifications to the basic EVM configuration.
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Page 12: Programmable Gain Amplifier Gain Control
Programmable Gain Amplifier Gain Control 1.3 Programmable Gain Amplifier Gain Control The THS7001 IC is provided with three digital control inputs for setting the gain of the PGA stage (G0 – G2). Standard TTL or CMOS Logic signals operate these control inputs. The gain control inputs are not latched and respond to the control signals in real time. -
Page 13: Simplified Pga Section Of The Ths7001
Programmable Gain Amplifier Gain Control Figure 1–3. Simplified PGA Section of the THS7001 No Source Impedance V IN G 0 G 1 G 2 THS7001 IC –V IN R SOURCE Positive R TERMINATION Clamp V H – V OUT V REF... -
Page 14: Evm Dip Switch Functionality
EVM DIP Switch Functionality 1.4 EVM DIP Switch Functionality The THS7001 can be fully evaluated without any external digital control signals applied. This is accomplished through the use of a DIP switch. The DIP switch incorporates six SPST switches labeled A through F. The functionality of each switch is described in Table 1–2. -
Page 15: Evm Circuit Configuration
Jumper JP3: 1–2 — Connects the THS7001 IC positive clamp input pin (VH) to 2–3 — Connects the THS7001 IC positive clamp input pin (VH) to +5V For example, to use the preamplifier as a buffer and gain: 1) Set JP1 to 2–3 2) Set JP2 to 2–3... -
Page 16: Using The Ths7001 Evm
9) Connect a signal input to the INPUT A BNC (J6). Note that each input connector on this EVM is terminated with a 50-Ω resistor to ground. With a 50-Ω source impedance, the voltage seen by the THS7001 amplifier IC on the EVM will be the source signal voltage applied to the EVM input connector. -
Page 17: Ths7001 Evm Performance
THS7001 EVM Performance 1.7 THS7001 EVM Performance Figure 1–5 shows the typical frequency and phase response the THS7001 EVM preamplifier with 15-V supplies and Figure 1–6 shows the typical frequency and phase response of the THS7001 EVM preamplifier with 5-V supplies. - Page 18 EVM PGA with 15-V supplies and Figure 1–8 shows the typical frequency and phase response of the THS7001 EVM PGA with 5-V supplies. This data was collected with the gain set to +2 dB. Typical – 3 dB bandwidth is 70 MHz with a 5-V power supply and 80 MHz with a 15-V power supply.
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Page 19: Ths7001 Evm Preamplifier + Pga Response, Vcc
THS7001 EVM Performance Figure 1–9 shows the typical frequency and phase response of the THS7001 EVM preamplifier + PGA with 15-V supplies and Figure 1–10 shows the typical frequency and phase response of the THS7001 EVM preamplifier + PGA with 5-V supplies. This data was collected with the preamplifier directly driving the PGA input. -
Page 20: General High-Speed Amplifier Design Considerations
General High-Speed Amplifier Design Considerations 1.8 General High-Speed Amplifier Design Considerations The THS7001 EVM layout has been designed and optimized for use with high-speed signals and can be used as an example when designing THS7001 applications. Careful attention has been given to component selection, grounding, power supply bypassing, and signal path layout. -
Page 21: Powerpad Pcb Etch And Via Pattern
1.9 General PowerPAD Design Considerations The THS7001 IC is mounted in a special package incorporating a thermal pad that transfers heat from the IC die directly to the PCB. The PowerPAD package is constructed using a downset leadframe. The die is mounted on the leadframe but is electrically isolated from it. -
Page 22: General Powerpad Design Considerations
7) Apply solder paste to the exposed thermal pad area and all of the operational amplifier terminals. 8) With these preparatory steps in place, the THS7001 is simply placed in position and run through the solder reflow operation as any standard surface-mount component. - Page 23 General PowerPAD Design Considerations Even though the THS7001 EVM PCB is different from the one in the example above, the results should give an idea of how much power can be dissipated by the PowerPAD IC package. The THS7001 EVM is a good example of proper thermal management when using PowerPAD-mounted devices.
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Page 24: Ths7001 Evm Specifications
......3.8 W, max For complete THS7001 amplifier IC specifications and parameter measure- ment information, and additional application information, see the THS7001 data sheet, TI Literature Number SLOS214. -
Page 25: Reference
Chapter 2 Reference This chapter includes a parts list and PCB layout illustrations for the THS7001 EVM. Topic Page THS7001 Dual Differential Line Drivers and Receivers ......... . . -
Page 26: Ths7001 Programmable-Gain Amplifier Evm Parts List
THS7001 Programmable-Gain Amplifier EVM Parts List 2.1 THS7001 Programmable-Gain Amplifier EVM Parts List Table 2–1. THS7001 EVM Parts List Manufacturer/Distributor Reference Description Size Part Number CAPACITOR, 6.8 µF, 35V, 20%, TANTALUM, SM C4, C5, C21 (SPRAGUE) 293D685X9035D2T CAPACITOR, 0.1 µF, CERAMIC, 10%, SM C9 –... -
Page 27: Ths7001 Evm Board Layouts
THS7001 EVM Board Layouts 2.2 THS7001 EVM Board Layouts Board layout examples of the THS7001 EVM PCB are shown in the following illustrations. They are not to scale and appear here only as a reference. Figure 2–1. THS7001 EVM PC Board: Top Assembly Figure 2–2. -
Page 28: Ths7001 Evm Pc Board: Bottom Layer
THS7001 EVM Board Layouts Figure 2–3. THS7001 EVM PC Board: Bottom Layer (Top VIew) Reference...
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