Table of Contents

Advertisement

Jack board

(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
(Lead free solder used in the board (material : Sn-Cu, melting point : 230 Centigrade))
AUDIO IN
HP
W8400
J8400
C8402
C8403
C8401
C8405
C8404
P1G
T1G
No.MB711
W8301
J8401
K8300
K8301
K8320
C8453
R8451
C8452
R8403
R8404
W8300
R8300
R8301
1
CN840
GVA10176-A4
7
(No.MB711<Rev.002>)23/35
W8100
D8200
D8201
K8200
D8300
D8301
C8202
K8202
K8201
USB B
W8200
D8303
D8302
C8303
R8201
USB A
R8100
R8200
R8101
A
USB C
D8100
K8105
A
D8101
K8100
K8101
K8102
created date:2009-09-08

Hide quick links:

Advertisement

Table of Contents
loading

Table of Contents